Intel Corporation

Shanto A Thomas

Navneet Kumar Singh

Ranjul Balakrishnan

Methods of forming microelectronic package structures, and structures formed thereby, are described. Those methods/structures may include attaching a die on a board,

Methods of forming package structures for enhanced memory capacity and structures formed thereby

Methods of forming microelectronic package structures, and structures formed thereby, are described. Those methods/structures may include attaching a die on a board, attaching a substrate on the die, wherein the substrate comprises a first region and a peripheral region, attaching a first memory device on the central region of the substrate, and attaching at least one additional memory device on the peripheral region of the substrate, wherein the at least one additional memory device is not disposed over the die.

Growing community of inventors

Bengaluru, India

Shanto A Thomas