Opto Power Corporation

Shantanu Gupta

Rushikesh M Patel

Stewart Wayne Wilson

David Pace Caffey

Dennis James Brown

A substrate comprising, for example, a copper-beryllium oxide ceramic-copper sandwich permits a laser diode along with cooperative components to be soldered in place using a high temperature solder. The sandwich structure is operative to move the effective thermal properties of the copper more towards that of the beryllium oxide thus reducing, for example, any stress which might occur between the solder, the substrate, and the laser diode. The use of high temperature solder provides for significantly improved operation.

Semiconductor laser diode multi-chip module

An array of laser diodes, or laser diode bars, is formed by positioning adjacent diodes or bars in an offset or staircase arrangement where the emitting facets of adjacent diodes, or bars, are in different planes. The offset arrangement permits the light from adjacent facets to be separated a distance q much shorter than permitted by prior art stacking arrangements because thermal and mechanical constraints characteristic of prior art stacks, are relaxed considerably in the offset arrangement. Power densities of 2000 watts/cm.sup.2 (cw) are achieved with spacings of 0.6 mm between adjacent laser bars, a ten fold increase in power density over in-plane (prior art) positioning of like components.

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Tucson, AZ, United States of America

Shantanu Gupta