Teradyne, Inc.

Shant Orchanian

Valquirio Nazare Carvalho

Peter A Reichert

Philip Luke Campbell

Larry W Akers

An example test system includes a carrier having a test socket to receive a device to test. The test socket includes electrical connections. The test system also includes a lid assembly having a socket cap to contact the device to apply pressure to cause the device to connect electrically to the electrical connections. The socket cap includes a material having a thermal conductivity that exceeds a defined value. The lid assembly also includes one or more structures configured to provide surface area over which heat from the device dissipates. The one or more structures are made of a material having a thermal conductivity that exceeds the defined value.

System for testing devices inside of carriers

An example test system includes a test carrier to receive a device to test. The test carrier includes test components to perform at least a structural test on the device. The example test system also includes a slot to receive the test carrier. The slot includes an interface to which the test carrier connects to enable the test carrier to communicate with a system that is part of the test system or external to the test system.

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Winchester, MA, United States of America

Shant Orchanian