Huawei Technologies Co., Limited

Honor Device Co., Ltd.

Tonghua Dongbao Pharmaceutical Co., Ltd.

Shanshan Wei

Haohui Long

Yanfeng Liang

Jianhui Li

Jianping Fang

Yong She

Shi Zhang

Lin Qu

Zhongyu Zhang

Xiaolong Li

Depeng Wang

Nan Zhang

Chunsheng Leng

Xindan Fan

Yuanjian Liu

Xiaohui Chang

Yingbo Zhao

A chip transfer method includes: first, providing a stretchable layer, where the stretchable layer includes a first cloth layer and a second cloth layer, a plurality of first fibers and a plurality of second fibers located between the first cloth layer and the second cloth layer, and a plurality of intersections exist between the first fiber and the second fiber; sticking the stretchable layer to chips, where the first cloth layer is closer to the chips than the second cloth layer; then, separating a plurality of chips, where the plurality of separated chips are separately connected to the first fiber and the second fiber; respectively disposing, at a plurality of preset locations of the substrate, the plurality of chips stuck to the stretchable layer; and removing the first fiber and the second fiber.

Chip transfer method and electronic device

Provided are a stable secukinumab injection and a preparation method therefor. The stable secukinumab injection is composed of the following ingredients: 50 mg/ml-300 mg/ml of secukinumab, 5 mmol/L-50 mmol/L of histidine and a histidine hydrochloride, 5 mmol/L-50 mmol/L of methionine, 150 mmol/L-400 mmol/L of a low-sugar alcohol, and 0.01%-0.02 of polysorbate 80, wherein the balance is water for injection, and the pH is 5.0-7.0. Stability tests prove that the quality of the stable secukinumab injection is stable, wherein the stability thereof is superior to that of commercial varieties on the market, and same has various indicators that meet the relevant regulations of the Chinese Pharmacopoeia, and has good application prospects.

Stable secukinumab injection and preparation method therefor

This application provides a display panel, a display screen including the display panel, and an electronic device including the display screen. The display panel includes a thin film transistor backplane, an organic layer, and a packaging layer that are successively stacked. The display panel is provided with a through hole, which runs through the thin film transistor backplane, the organic layer, and the packaging layer; the display panel includes a non-display area and a display area, the non-display area being disposed around the through hole and the display area being disposed around the non-display area; the organic layer includes a first organic layer and a second organic layer, the first organic layer is a part located in the display area, and the second organic layer is a part located in the non-display area.

Display panel and manufacturing method therefor, display screen, and electronic device

A touchscreen for a narrow-frame electronic device including a conductive layer, a display module, a first circuit board, and a second circuit board. The conductive layer includes a touch sensing electrode and N first traces. The first circuit board includes a touch driving integrated circuit. The second circuit board includes at least one wire. The touch sensing electrode is coupled to a first end of each of the N first traces. A second end of each of M first traces is coupled to a first end of one wire on the second circuit board through the display module, and a second end of each wire on the second circuit board is coupled to the touch driving integrated circuit. The at least one wire on the second circuit board is configured to couple the second end of each of the M first traces to the touch driving integrated circuit.

Touchscreen for narrow-frame electronic device, and electronic device

An electronic device and a method for manufacturing the display apparatus. The electronic device includes a display apparatus and a processor, wherein the display apparatus includes an active-matrix organic light emitting diode (AMOLED) panel, a touch panel, a chip IC, and a printed circuit board. The touch panel is disposed on an upper surface of the AMOLED panel, and the touch panel and the AMOLED panel each has an outgoing line. The outgoing line of the touch panel and the outgoing line of the AMOLED panel are separately extended to form an outgoing line extension end of the touch panel and an outgoing line extension end of the AMOLED panel. The outgoing line extension end of the AMOLED panel and the outgoing line extension end of the touch panel are electrically connected to the printed circuit board PCB by using the chip IC.

Display apparatus, method for manufacturing display apparatus, and electronic device

A display includes at least an array substrate, and the array substrate has a drive circuit layer. At least one first notch is provided on an outer edge of a lead-out side of the array substrate, and a first conductor is disposed in each first notch. A first end of the first conductor is in contact with a lead end of the drive circuit layer, and a second end of the first conductor extends along the first notch to a back side of the array substrate.

Display module and display device

Growing community of inventors

Shanghai, China

Shanshan Wei