Fraunhofer-Gesellschaft Zur Foerderung Der Angewandten Forschung E.V.

Huawei Technologies Co., Limited

Shanshan Gu-Stoppel

Hans Joachim Quenzer

Joachim Janes

Fabian Lofink

Ulrich Hofmann

Hans-Joachim Quenzer

Thomas Lisec

Bernhard Wagner

Frank Senger

Yong Cao

Fabian Stoppel

Malte Florian Niekiel

Dirk Kaden

Jide Liang

Felix Heinrich

Erdem Yarar

Christian Eisermann

Gunnar Wille

Oleg Petrak

Aloshious Thottappattu Joy

Fabian Schwarz

Frerk SÖRENSEN

Florian Niekiel

A MEMS includes a substrate having an element movably suspended relative to the substrate, the element having a first main surface and an opposite second main surface. The MEMS includes a first spring element connected between the substrate and a first column structure connected to the second main surface, and includes a second spring element connected between the substrate and a second column structure connected to the second main surface.

MEMS and method of manufacturing the same

Micro-Electro-Mechanical System (MEMS) devices may include at least one actuator. The actuator has a first end attachable to more than one side of a frame of the MEMS device, and has a second end attachable to a stage of the MEMS device, particularly via a joint. Further, the second end of the actuator is configured to bend upwards or downwards when the actuator is driven and the first end is attached.

Two degree-of-freedom actuator and MEMS device

A micromechanical sound transducer according to a first aspect includes a first bending transducer with a free end and a second bending transducer with a free end, the two bending transducers being arranged in a mutual plane, wherein the free end of the first bending transducer is separated from the free end of the second bending transducer via a slit. The second bending transducer is excited in-phase with the vertical vibration of the first bending transducer. A micromechanical sound transducer according to a second aspect includes a first bending transducer that is excited to vibrate vertically and a diaphragm element extending vertically to the first bending transducer, the diaphragm element being separated from a free end of the first bending transducer via a slit.

Micromechanical sound transducer

Embodiments of the present invention provide an apparatus including a micromirror, an excitation structure containing or supporting the micromirror, and at least one piezoelectric sensor. The excitation structure includes at least one piezoelectric actuator, the excitation structure being configured to resonantly excite the micromirror so as to cause a deflection of the micromirror. The at least one piezoelectric sensor is configured to provide a sensor signal dependent on the deflection of the micromirror, the piezoelectric sensor being connected to the excitation structure so that during the resonant excitation of the micromirror, the sensor signal and the deflection of the micromirror exhibit a fixed mutual phase relationship.

Piezoelectric position sensor for piezoelectrically driven resonant micromirrors

Apparatuses with actuators having actuator-side attachment areas disposed thereon, an optical element having mirror-side attachment areas disposed thereon and springs are described, wherein an optical element is connected to actuators via two or four springs.

Apparatus comprising a spring and an optical element suspended thereon

The underlying invention presents a device which connects a vibratably suspended optical element to at least two actuators mounted fixedly on one side via curved spring elements, wherein the actuators are implemented to cause the vibratably suspended optical element to vibrate via the curved spring elements. Both the actuators and the entire system may be implemented to be more robust and be operated more reliably due to the curved shaping of the spring elements.

Device comprising a vibratably suspended optical element

The invention relates to an MEMS structure with a stack made of different layers and a spring-and-mass system varying in its thickness which is formed of the stack, and wherein, starting from a back side of the stack and the substrate, at laterally different positions, the substrate while leaving the first semiconductor layer, or the substrate, the first etch-stop layer and the first semiconductor layer are removed, and to a method for manufacturing such a structure.

Device comprising a spring and an element suspended thereon, and method for manufacturing same

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Itzehoe, Germany

Shanshan Gu-Stoppel