Dell Products Inc.

Shannon R Bynum

Salvador Jimenez

Hasnain Shabbir

Dinesh Kunnathur Ragupathi

Dominick Adam Lovicott

Ralph Warren Jensen

Tracey Kannmacher

Joshua M Boggs

In accordance with these and other embodiments of the present disclosure, a system may include a plurality of temperature sensors configured to sense temperatures at a plurality of locations associated with an information handling system, a cooling subsystem comprising at least one cooling fan configured to generate a cooling airflow in the information handling system, and a thermal manager communicatively coupled to the plurality of temperature sensors and the cooling subsystem. The thermal manager may be configured to, based on at least a power provided to a subsystem of the information handling system, estimate a thermal condition proximate to the subsystem, based on a maximum power consumption for a component of the subsystem, determine an estimated linear airflow velocity requirement for the component, and set a speed of the at least one cooling fan based on the estimated thermal condition and the estimated linear airflow velocity requirement.

Systems and methods for thermal management of an information handling system including cooling for third-party information handling resource

A backplane securing apparatus includes a chassis defining an information handling system housing ('IHS'). A first member is moveably coupled to the chassis, whereby the first member is operable to move along a first direction. A second member defines a rear portion of the IHS housing and is moveably coupled to the first member, whereby the second member is operable to move along a second direction in response to the first member moving along the first direction. A backplane may be coupled to the chassis using the second member, and an IHS may then be coupled to the backplane.

Backplane securing device for an information handling system

A component coupling apparatus includes a wall comprising a first surface, a second surface located opposite the first surface, and defining a guide coupling aperture extending through the wall from the first surface to the second surface. A first guide member is coupled to the wall through the guide coupling aperture and positioned adjacent the first surface. A second guide member is coupled to the wall through the guide coupling aperture and positioned adjacent the second surface. A component may be coupled to the wall using the guide member.

Method and apparatus for coupling a component in a chassis

A heat sink retention system and method secures a heat sink proximate to a packaged electronic component, such as central processing unit, by rotationally engaging the heat sink with a retaining structure secured to an information handling system planar, such as a motherboard. The retaining structure has an opening aligned with the packaged electronic component and securing lips that extend into the opening. The heat sink inserts into the opening and is rotated slightly to engage flanges extending from its base into the securing lips. The position of the securing lips relative to the planar and the thickness of the flanges results in the base of the secured heat sink having a predetermined clearance from the packaged electronic component. A locking detent biases the heat sink to contact the packaged electronic component and allows limited movement out to the predetermined clearance, thus allowing the absorption of shock without excessive heat sink movement.

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Round Rock, TX, United States of America

Shannon R Bynum