Taiwan Semiconductor Manufacturing Comp. Ltd.

Shang-Yun Tu

Chen-Shien Chen

Ming Hung Tseng

Chen-Cheng Kuo

Yao-Chun Chuang

Sheng-Yu Wu

Ching-Hui Chen

Mirng-Ji Lii

Ching-Wen Hsiao

Chita Chuang

Hua-Wei Tseng

Hao-Juin Liu

Hsu-Hsien Chen

A display device includes a semiconductor substrate, an isolation layer, a light-emitting layer and a second electrode. The semiconductor substrate has a pixel region and a peripheral region located around the pixel region. The semiconductor substrate includes first electrodes and a driving element layer. The first electrodes are disposed in the pixel region and the first electrodes are electrically connected to the driving element layer. The isolation layer is disposed on the semiconductor substrate. The isolation layer includes a first isolation pattern disposed in the peripheral region, and the first isolation pattern has a first side surface and a second side surface opposite to the first side surface. The light-emitting layer is disposed on the isolation layer and the first electrodes, and covers the first side surface and the second side surface of the first isolation pattern. The second electrode is disposed on the light-emitting layer.

Display device and manufacturing method thereof

Conductive structures and the redistribution circuit structures are disclosed. One of the conductive structures includes a first conductive layer and a second conductive layer. The first conductive layer is disposed in a lower portion of a dielectric layer, and the first conductive layer includes an upper surface with a protrusion at an edge. The second conductive layer is disposed in an upper portion of the dielectric layer and electrically connected to the first conductive layer. An upper surface of the second conductive layer is conformal with the upper surface of the first conductive layer.

Conductive structures and redistribution circuit structures

Redistribution circuit structures and methods of forming the same are disclosed. One of the redistribution circuit structures includes a first conductive structure, a dielectric layer and a second conductive structure. The dielectric layer is disposed over and exposes a portion of the first conductive structure. The second conductive structure is disposed in the dielectric layer to electrically connect to the first conductive structure, and includes a first conductive layer and a second conductive layer disposed on and electrically connected to the first conductive layer. The first conductive layer includes a main portion and a conductive protrusion, the conductive protrusion is disposed on an entire edge of an upper surface of the main portion, and a top of the conductive protrusion is higher than the upper surface of the main portion.

Redistribution circuit structures and methods of forming the same

A method for manufacturing a semiconductor package structure is provided. A semiconductor substrate comprising a conductive pad is provided, wherein the conductive pad is coupled with a circuitry of the semiconductor substrate. A patterned passivation layer exposing a portion of the conductive pad is formed. An uneven surface of the conductive pad is formed. A photoresist is formed on the semiconductor substrate. The photoresist is exposed under a light beam, wherein the light beam is scattered by the uneven surface. The photoresist is developed to form an opening in the photoresist so as to expose the conductive pad and form a plurality of cavities in the remaining photoresist. A conductive material is formed in the opening and the plurality of cavities.

Method for manufacturing semiconductor package structure

A die includes a substrate, a metal pad over the substrate, and a passivation layer covering edge portions of the metal pad. A metal pillar is formed over the metal pad. A portion of the metal pillar overlaps a portion of the metal pad. A center of the metal pillar is misaligned with a center of the metal pad.

Connector structures of integrated circuits

Method of manufacturing connector structures of integrated circuits

A semiconductor package structure includes a first semiconductor substrate including a conductive pad; and a conductive pillar on the conductive pad and disposed between the first semiconductor substrate and a second semiconductor substrate. The conductive pad is coupled with a circuitry of the first semiconductor substrate. The conductive pillar extends along a longitudinal axis and toward the second semiconductor substrate. The conductive pillar includes a sidewall with a rough surface notching toward the longitudinal axis.

Growing community of inventors

Hsinchu, Taiwan

Shang-Yun Tu