Powertech Technology Inc.

Shang-Yu Chang Chien

Hung-Hsin Hsu

Nan-Chun Lin

Han-Wen Lin

Li-Chih Fang

Wen-Jeng Fan

Chia-Yu Hung

Wen-Hsiung Chang

Ching-Wei Liao

Pei-Chun Tsai

A package structure and a manufacturing method thereof are provided. The package structure includes a first package and a second package, and the second package is disposed on the first package. The first package includes a first redistribution layer, at least one chip and a second redistribution layer. The chip is disposed between the first redistribution layer and the second redistribution layer. The second package includes a third redistribution layer and at least three light-emitting elements. The third redistribution layer is electrically connected to the second redistribution layer, and the second redistribution layer is disposed between the chip and the third redistribution layer. The light-emitting elements are disposed on the third redistribution layer and electrically connected to the third redistribution layer. Each light-emitting element includes a first surface opposite to the third redistribution layer, and the first surfaces of the light-emitting elements are coplanar.

Package structure and manufacturing method thereof

Provided is an integrated antenna package structure including a chip, a circuit structure, a shielding body, an encapsulant, a first antenna layer, a dielectric body, and a second antenna layer. The circuit structure is electrically connected to the chip. The shielding body is disposed on the circuit structure and has an accommodating space. The chip is disposed in the accommodating space of the shielding body. The encapsulant is disposed on the circuit structure and covers the chip. The first antenna layer is disposed on the circuit structure and is electrically connected to the circuit structure. The dielectric body is disposed on the encapsulant. The second antenna layer is disposed on the dielectric body. A manufacturing method of the integrated antenna package structure is also provided.

Integrated antenna package structure and manufacturing method thereof

A package structure including a first die, a second die, an encapsulant, a dam structure, a light-transmitting sheet, a conductive connector, a circuit layer, and a conductive terminal is provided. The first die includes a first active surface. The first active surface has a sensing area. The second die is arranged such that a second back surface thereof faces the first die. The encapsulant covers the second die. The encapsulant has a first encapsulating surface and a second encapsulating surface. The dam structure is located on the first encapsulating surface and exposes the sensing area. The light-transmitting sheet is located on the dam structure. The conductive connector penetrates the encapsulant. The circuit layer is located on the second encapsulating surface. The first die is electrically connected to the second die through the conductive connector and the circuit layer. The conductive terminal is disposed on the circuit layer.

A package structure including a first die, a second die, a dielectric body, a conductive terminal, a circuit layer and a patterned insulating layer is provided. The second die is disposed on the first die. A second active surface of the second die faces a first active surface of the first die. The dielectric body covers the first die. The conductive terminal is disposed on the dielectric body and opposite to the second die. The circuit layer includes a first circuit portion and a second circuit portion. The first circuit portion penetrates the dielectric body. The first die is electrically connected to the conductive terminal through the first circuit portion. The second circuit portion is embedded in the dielectric body. The second die is electrically connected to the first die through the second circuit portion. The patterned insulating layer covers the circuit layer and is embedded in the dielectric body.

A packaging structure including first, second, and third dies, an encapsulant, a circuit structure, and a filler is provided. The encapsulant covers the first die. The circuit structure is disposed on the encapsulant. The second die is disposed on the circuit structure and is electrically connected to the circuit structure. The third die is disposed on the circuit structure and is electrically connected to the circuit structure. The third die has an optical signal transmission area. The filler is disposed between the second die and the circuit structure and between the third die and the circuit structure. A groove is present on an upper surface of the circuit structure. The upper surface includes first and second areas located on opposite sides of the groove. The filler directly contacts the first area. The filler is away from the second area. A manufacturing method of a packaging structure is also provided.

A package structure including a first die, an encapsulant, a first circuit structure, a second circuit structure, a conductive connector, a second die, and a filler is provided. The encapsulant covers the first die and has a first surface and a second surface opposite to each other. The first circuit structure is disposed on the first surface. The second circuit structure is disposed on the second surface. The conductive connector penetrates the encapsulant. The second die is disposed on the second circuit structure. The second die has an optical signal transmission area. The filler is disposed between the second die and the second circuit structure. An upper surface of the second circuit structure has a groove. The upper surface includes a first area and a second area disposed on opposite sides of the groove. The filler directly contacts the first area. The filler is disposed away from the second area.

A package structure, including a conductive element, multiple dies, a dielectric body, a circuit layer and a patterned insulating layer, is provided. The multiple dies are disposed on the conductive element. A portion of the conductive element surrounds the multiple dies. The dielectric body covers the multiple dies. The circuit layer is disposed on the dielectric body. The circuit layer is electrically connected to the multiple dies. The patterned insulating layer covers the circuit layer. A portion of the patterned insulating layer is disposed between the dies that are adjacent. A manufacturing method of a package structure is also provided.

Package structure including multiple dies surrounded by conductive element and manufacturing method thereof

A package structure, including a redistribution circuit layer, a first die, a dielectric body, a first connection circuit, a patterned insulating layer, a second die and a third die, is provided. The first die is disposed on the redistribution circuit layer and is electrically connected to the redistribution circuit layer. The dielectric body is disposed on the redistribution circuit layer and covers the first die. The first connection circuit is disposed on the dielectric body and is electrically connected to the redistribution circuit layer. The patterned insulating layer covers the first connection circuit. A portion of the patterned insulating layer is embedded in the dielectric body. The second die is disposed on the dielectric body and is electrically connected to the first connection circuit. The third die is disposed on the redistribution circuit layer, is opposite to the first die, and is electrically connected to the redistribution circuit layer.

Package structure having a first connection circuit and manufacturing method thereof

The disclosure provides a package structure including a redistribution circuit structure, a first circuit board, a second circuit board, a first insulator, multiple conductive terminals, and a package. The redistribution circuit structure has a first connection surface and a second connection surface opposite to each other. The first circuit board and the second circuit board are disposed on the first connection surface and are connected electrically to the redistribution circuit structure. The first insulator is disposed on the first connection surface and covers the first circuit board and the second circuit board. The conductive terminals are connected electrically to and disposed on the first circuit board or the second circuit board. The package is disposed on the second connection surface and is connected electrically to the redistribution circuit structure. A manufacturing method of a package structure is also provided.

A package structure including a redistribution circuit structure, an insulator, a plurality of conductive connection pieces, a first chip, a second chip, an encapsulant, a third chip, and a plurality of conductive terminals is provided. The redistribution circuit structure has first and second connection surfaces opposite to each other. The insulator is embedded in and penetrates the redistribution circuit structure. The conductive connection pieces penetrate the insulator. The first and second chips are disposed on the first connection surface. The encapsulant is disposed on the redistribution circuit structure and at least laterally covers the first and second chips. The third chip is disposed on the second connection surface and electrically connected to the first and second chips through the conductive connection pieces. The conductive terminals are disposed on the second connection surface and electrically connected to the first chip or the second chip through the redistribution circuit structure.

An integrated antenna package structure including a chip, a circuit layer, an encapsulant, a coupling end, an insulating layer, a conductive connector, a dielectric substrate, and an antenna is provided. The circuit layer is electrically connected to the chip. The encapsulant is disposed on the circuit layer and covers the chip. The coupling end is disposed on the encapsulant. The insulating layer covers the coupling end. The insulating layer is not externally exposed. The conductive connector penetrates the encapsulant. The coupling end is electrically connected to the circuit layer by the conductive connection. The dielectric substrate is disposed on the encapsulant and covers the coupling end. The antenna is disposed on the dielectric substrate. A manufacturing method of an integrated antenna package structure is also provided.

A semiconductor package structure, including a circuit substrate, at least two chips, an encapsulant, and a redistribution layer, is provided. The circuit substrate has a first surface and a second surface opposite to the first surface. The at least two chips are disposed on the first surface. Each of the at least two chips has an active surface facing the circuit substrate and includes multiple first conductive connectors and multiple second conductive connectors disposed on the active surface. A pitch of the first conductive connectors is less than a pitch of the second conductive connectors. The encapsulant encapsulates the at least two chips. The redistribution layer is located on the second surface. The first conductive connectors are electrically connected to the redistribution layer by the circuit substrate. The second conductive connectors are electrically connected to the circuit substrate. A manufacturing method of a semiconductor package structure is also provided.

Semiconductor package structure and manufacturing method thereof

A package structure including a first circuit board, a second circuit board, an encapsulant, a plurality of conductive terminals, and a package device is provided. The first circuit board has a first top surface and a first bottom surface opposite to each other. The second circuit board has a second top surface and a second bottom surface opposite to each other. The encapsulant encapsulates the first and second circuit boards. The conductive terminals are disposed on the first or second bottom surface and electrically connected to the first or second circuit board. The package device is disposed on the first or second top surface and electrically connected to the first and second circuit boards. The package device includes a first chip, a second chip, a chip encapsulant, a circuit layer, and a plurality of conductive package terminals. A manufacturing method of a package structure is also provided.

A packaging structure includes a bridge die, a through silicon via die, a first encapsulant, a first active die, a second active die, a second encapsulant, and a redistribution circuit structure. The first encapsulant covers the through silicon via die and the bridge die. The first active die is electrically connected to the bridge die and the through silicon via die. The second active die is electrically connected to the bridge die. The second encapsulant covers the first active die and the second active die. The redistribution circuit structure is electrically connected to the through silicon via die. The through silicon via die is disposed between the first active die and the redistribution circuit structure. A manufacturing method of a packaging structure is also provided.

Packaging structure and manufacturing method thereof

A semiconductor package including a plurality of first chips, a plurality of through silicon vias, a least one insulator, a first circuit structure and a first encapsulant is provided. The first chip electrically connected to the through silicon vias includes a sensing area on a first active surface, a first back surface and a plurality of through holes extending from the first back surface towards the first active surface. The insulator is disposed on the first active surfaces of the first chips. The first circuit structure disposed on the first back surfaces of the first chips and electrically connected to the through silicon vias. The first encapsulant, laterally encapsulating the first chips.

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Hsinchu County, Taiwan

Shang-Yu Chang Chien