Unimicron Technology Corporation

Coretronic Corporation

Phoenix Precision Technology Corporation

Ritdisplay Corporation

Shang-Wei Chen

Shih-Ping Hsu

Chao-Wen Shih

Kan-Jung Chia

Ching-Ho Hsieh

Shih-Ming Hsu

Ming-Hsing Wu

Chin-Long Wu

Min-Yi Hsu

Tung-Yang Tang

Suo-Hsia Tang

Tien-Rong Lu

Chu-Chin Hu

Ming-Dah Liu

Chao-Hung Weng

Ming-Tsung Weng

Han-Wen Tsai

Yih Chang

Fang-Hsuan Su

Hsuan-I Wu

Chung-Cheng Lien

Ming-Feng Kuo

Yen-Mo Yu

Wen-Hsin Lo

Chih-Jen Yang

Kuei-Sheng Wu

Tien Wang Huang

Ching-Tang Yang

Hsin Tzu Yao

Tein-Wang Huang

A projection apparatus includes an illumination system, a prism assembly, a first light valve, a second light valve and a projection lens. The illumination system includes a blue light emitting element, a red light emitting element, a wavelength conversion device, a dichroic assembly, a first light diffusing element and a second light diffusing element. The second light diffusing element has a diffusion area and a non-diffusion area. The diffusion area is located on a transmission path of a blue beam from the dichroic assembly, and the non-diffusion area is located on a transmission path of a green beam from the dichroic assembly. The prism assembly has a dichroic film. The dichroic film is configured to transmit a red beam to the first light valve. The dichroic film is configured to transmit the green beam and the blue beam to the second light valve.

Projection apparatus

An illumination system, including a first light source for providing a first beam; a second light source for providing a second beam; a wavelength conversion element having a reflection region and a conversion region, wherein the reflection region is for reflecting the first beam and the conversion region is for converting the first beam into a third beam; a first light splitting element for allowing the second beam to pass; a second light splitting element for reflecting the first beam penetrated by the first light splitting element and allowing the second beam to pass, wherein the first light splitting element is disposed between the wavelength conversion element and the second light splitting element; and a light homogenizing element for receiving the first beam, the second beam, and the third beam, and generating an illumination beam, is provided. A projection apparatus including the illumination system is also provided.

Illumination system and projection apparatus

Electronic connector

A printed circuit board (PCB) stack structure and method of forming the same are provided. The printed circuit board stack structure includes a first PCB, a second PCB and a connector. The first PCB includes a first pad. The second PCB includes a second pad. The connector has an annular structure, located between the first PCB and the second PCB and electrically connecting the first PCB to the second PCB. The connector includes a substrate, a first conductive elastic piece and a second conductive elastic piece. The substrate has a first surface and a second surface opposite to each other. The first conductive elastic piece is located on the first surface and in electrical contact with the first pad. The second conductive elastic piece is located on the second surface and in electrical contact with the second pad.

Printed circuit board stack structure and method of forming the same

A transfer printing apparatus includes a mold, a stamper, a pressing roller and a curing unit. The mold has a first surface with first and second concavities, the second concavity has first and second planes, the first plane is perpendicular to the first surface, and the second plane is inclined to the first surface. The stamper having a second surface is disposed in the first concavity. The first and second surfaces are coplanar, and the second surface has transfer printing microstructures. The first and second surfaces are suitable for coated an adhesive layer. The pressing roller presses a base film onto the adhesive layer, such that the adhesive layer is integrated with the base film. The curing unit cures the adhesive layer on the base film, such that a taper corresponding to the second concavity and optical microstructures corresponding to the transfer printing microstructures are formed on the adhesive layer.

Transfer printing apparatus and manufacturing method of light guiding film

A backlight module includes a light guide plate (LGP), a light source, and at least one prism sheet. The LGP includes a light emitting surface, a bottom surface, a light incident surface, and a plurality of first microstructures on the bottom surface. Each of the first microstructure is a recessed structure and includes a first surface and a second surface. An included angle between the first surface and the bottom surface ranges from 15 degrees to 27 degrees. An included angle between the second surface and the bottom surface ranges from 50 degrees to 90 degrees. The light source provides a light beam, and an included angle between a light emitting direction of the light beam emitted from the light emitting surface of the LGP and a normal direction of the light emitting surface is greater than 30 degrees. The prism sheet is disposed above the light emitting surface.

Light guide plate and backlight module using the same

A circuit board structure with an embedded semiconductor chip and a fabrication method thereof are provided, including the steps of providing a semiconductor wafer having an active surface with a plurality of electrode pads, a connection metal layer formed on the electrode pads: forming a protective layer on the connection metal layer and the semiconductor wafer, performing a cutting process to form a plurality of semiconductor dies, providing a carrier board having at least one cavity for receiving the semiconductor chip; and forming sequentially on the protective layer covering the semiconductor chip and the carrier board a dielectric layer and a circuit layer electrically connected to the connection metal layer of the semiconductor chip. The present invention is a simple, in process and low in process cost, due to the connection metal layer covered by the protective layer formed on the semiconductor chip protected from oxidation and contamination.

Carrier board structure with embedded semiconductor chip and fabrication method thereof

A circuit board with identifiable information and a method for fabricating the same are proposed. At least one insulating layer within the circuit board has a non-circuit area free of a circuit layout. A plurality of openings are formed in the non-circuit area of the insulating layer. A patterned circuit layer is formed on the insulating layer. Metal identifiable information is disposed in the openings of the non-circuit area. By this arrangement, a product status of the circuit board can be traced and identified via the metal patterned information.

Circuit board with identifiable information and method for fabricating the same

A packaging substrate structure with a semiconductor chip embedded therein is disclosed, including a carrier board having a first and an opposed second surfaces and disposed with at least a through cavity; a semiconductor chip received in the through cavity, the chip having an active surface and an inactive surface opposite to one another, wherein the active surface has a plurality of electrode pads, a passivation layer is disposed on the active surface with the electrode pads exposed from the passivation layer, and metal pads are disposed on surfaces of the electrode pads; a buffer layer disposed on the first surface of the carrier board and on surfaces of the passivation layer and the metal pads; a first dielectric layer disposed on the buffer layer; and a first circuit layer disposed on the first dielectric layer and electrically connected with the metal pads of the chip via first conductive structures disposed in the buffer layer and the first dielectric layer, wherein the CTE (Coefficient of Thermal Expansion) of the buffer layer is between the CTE of the semiconductor chip and the CTE of the dielectric layer. Thereby, the buffer layer can reduce the stress on the interface between the dielectric layer and the semiconductor chip.

Packaging substrate structure with a semiconductor chip embedded therein

The present invention provides a circuit board structure with an embedded semiconductor chip and a method for fabricating the same. The circuit board structure includes a carrier board having a first surface, a second surface, and a through hole penetrating the carrier board from the first surface to the second surface; a semiconductor chip having an active surface whereon a plurality of electrode pads are formed and a non-active surface, embedded in the through hole; a photosensitive first dielectric layer formed on the first surface of the carrier board and an opening formed thereon to expose the non-active surface of the semiconductor chip; a photosensitive second dielectric layer formed on the second surface of the carrier board and the active surface of the semiconductor chip.

Circuit board structure with embedded semiconductor chip and method for fabricating the same

A plate structure having a chip embedded therein, comprises an aluminum plate having at least one aluminum oxide layer formed on its surface, and a cavity therein; a chip embedded in the cavity, wherein the chip has an active surface; at least one electrode pad mounted on the active surface; and a build-up structure mounted on the surface of the aluminum plate, the active surface of the chip, and the surface of the electrode pad, wherein the build-up structure comprises at least one conducting to electrically connect to the electrode pad. Besides, a method of manufacturing a plate structure having a chip embedded therein is disclosed. Therefore, the plate structure having a chip embedded therein can be processed by a simple method to achieve the tenacity of aluminum and the rigidity of aluminum oxide.

Plate structure having chip embedded therein and the manufacturing method of the same

An organic electroluminescent panel having a silver alloy is disclosed, which has a substrate; a plurality of the first electrodes; a plurality of the second electrodes; a plurality of conducting lines containing a silver alloy; a plurality of isolating walls; and a plurality of organic electroluminescent media. The first electrodes are arranged in parallel on the substrate. The organic electroluminescent media are disposed on the first electrodes. The second electrodes are disposed on the organic electroluminescent media. The conducting lines containing the silver alloy connect to the first electrodes or the second electrodes. The silver alloy contained in the conducting lines has 80 to 99.8 mol % of silver; 0.1 to 10 mol % of copper; and 0.1 to 10 mol % of at least one transition metal selected from the group consisting of palladium (Pd), magnesium (Mg), gold (Au), platinum (Pt), and the combinations thereof.

Silver alloy used in an organic electroluminescent panel

A package structure of an OEL panel includes a printed circuit board, at least one OEL panel, and several bumps. Wherein, the OEL panel has several poly solder interconnections arranged in an array structure. The printed circuit board has several solder pads, which are also implemented with bumps. The at least one OEL panel is disposed on the printed circuit board to have the electric connection with the printed circuit board through the poly solder interconnections and the bumps.

Package structure of organic electroluminescence panel

A process of packaging an OEL panel is disclosed. A printed circuit board is provided, wherein the printed circuit board comprises a plurality of bonding pads and a plurality of bumps on the bonding pads. Next, at least one OEL panel having a plurality of polysolder interconnections is provided. Next, the OEL panel disposed on the printed circuit board. A reflow process is performed so that the OEL panel can electrically connect with the PCB by the polysolder interconnections. Because of the low-temperature reflow process, the process of packaging an OEL panel can be accomplished by a low temperature process.

Growing community of inventors

Hsin-Chu, Taiwan

Shang-Wei Chen