Advanced Semiconductor Engineering, Inc.

Shang Chien Chen

Chun Chen Chen

Yuanhao Yu

The present disclosure provides a semiconductor structure including a first substrate having a first surface, a first semiconductor device package disposed on the first surface of the first substrate, and a second semiconductor device package disposed on the first surface of the first substrate. The first semiconductor device package and the second semiconductor device package have a first signal transmission path through the first substrate and a second signal transmission path insulated from the first substrate. The present disclosure also provides an electronic device.

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Kaohsiung, Taiwan

Shang Chien Chen