Apaq Technology Co., Ltd.

Shang-Che Lan

Ming-Tsung Chen

Chieh Lin

Chien-Wei Lin

Yi-Liang Chen

A stacked solid electrolytic capacitor is provided in the present disclosure. The stacked solid electrolytic capacitor includes a capacitive module, a conductive module and a packaging structure. The capacitive module includes capacitive units stacked up sequentially. The conductive module includes a positive terminal, a negative terminal and at least one anti-oxidizing layer. The positive terminal is electrically connected to one of the capacitive units. The negative terminal is electrically connected to the one of the capacitive units through a conductive paste layer. The at least one anti-oxidizing layer is arranged between the negative terminal and the conductive paste layer. The packaging structure surrounds the capacitive module and the conductive module. Therefore, it is difficult for an oxide layer forming between the negative terminal and the capacitive units, and the equivalent series resistance of the stacked solid electrolytic capacitor can be reduced.

Stacked solid electrolytic capacitor, integrated circuit product and electronic product

The instant disclosure provides a capacitor package structure including a capacitor unit, a first enclosing layer and a second enclosing layer. The capacitor unit includes a capacitor, a first conductive pin and a second conductive pin. The first enclosing layer encloses the entire capacitor, a part of the first conductive pin and a part of the second conductive pin. The second enclosing layer encloses the entire first enclosing layer, a part of the first conductive pin and a part of the second conductive pin. One of the first enclosing layer and the second enclosing layer is a package gel formed by a package material, and another one of the first enclosing layer and the second enclosing layer is a moisture and air resistant film formed by a moisture and air resistant material.

Capacitor package structure

The present disclosure provides a stacked-type solid electrolytic capacitor package structure and a method of manufacturing the same. The capacitor package structure includes a capacitor unit, a solder unit, a package unit and a conductive unit. The capacitor unit includes a plurality of first stacked capacitors. Each first stacked capacitor includes a first positive portion and a first negative portion. The first positive portion has at least one first through hole. The first through holes of the first positive portions are in communication with each other to form a first communication hole. The solder unit includes a first connection solder for filling the first communication hole so as to connect the first positive portions with each other. The package unit includes a package body for enclosing the capacitor unit and the solder unit. The conductive unit includes a first conductive terminal and a second conductive terminal.

Growing community of inventors

Kaohsiung, Taiwan

Shang-Che Lan