Adesto Technologies Corporation

Axon Technologies Corporation

Adesto Technology Corporation

Monolithic Power Systems, Inc.

Shane Charles Hollmer

John Dinh

Nad Edward Gilbert

Derric Lewis

Narbeh Derhacobian

Stephen Trinh

Juan Pablo Saenz Echeverry

John Ross Jameson

Michael N Kozicki

Gideon Intrater

Foroozan Sarah Koushan

Bard Pedersen

Deepak Kamalanathan

Venkatesh P Gopinath

Daniel Wang

Ishai Naveh

Hendrik Hartono

Duong Vinh Hao

Chuanding Cheng

Nguyen Khac Hieu

Ming Sang Kwan

Jeff Kotowski

Michael Van Buskirk

Janet Wang

John Ross Jameson, Iii

Derric Jawaher Herman Lewis

Vasudevan Gopalakrishnan

A memory device can include a nonvolatile memory (NVM) cell array, data path circuits, coupled between the NVM cell array and an output of the device, that are configured to enable access to the NVM cell array via a plurality of bit lines. A first charge pump can generate a first voltage supply. A second charge pump can generate a second voltage supply. Switch circuits are configured to, in a first mode, couple the first voltage supply to data path circuits, and in a second mode, couple the second voltage supply to the data path circuits. The first charge pump, the second charge pump, the switch circuits, the data path circuits and the NVM cell array are formed with the same integrated circuit substrate. Corresponding methods and systems are also disclosed.

Nonvolatile memory devices, systems and methods with switching charge pump architectures

A selection circuit includes: a first selection device coupled between a write IO line and a first node; a second selection device coupled between a read IO line and a second node; a third selection device controllable by a first address decode signal, and coupled between a first bit line and a third node; a fourth selection device controllable by a second address decode signal, and coupled between a second bit line and the third node; a first suppression device controllable by a write enable signal, and coupled between the second node and ground; a second suppression device controllable by a read enable signal, and coupled between the first node and ground; a first isolation device controllable by the write enable signal, and coupled between the first and third nodes; and a second isolation device controllable by the read enable signal, and coupled between the second and third nodes.

Memory device with adaptive noise and voltage suppression during read-while-write operations

A method of controlling a memory device can include: receiving, by an interface, a write command from a host; beginning execution of a write operation on a first array plane of a memory array in response to the write command, where the memory array includes a plurality of memory cells arranged in a plurality of array planes; receiving, by the interface, a read command from the host; reconfiguring the write operation in response to detection of the read command during execution of the write operation; beginning execution of a read operation on a second array plane in response to the read command; and restoring the configuration of the write operation after the read operation has at least partially been executed.

Concurrent read and reconfigured write operations in a memory device

A memory device can include a plurality of banks, each bank including a memory cell array of nonvolatile (NV) memory cells; a plurality of charge pumps, including a first charge pump and second charge pump; and a switch circuit. The switch circuit can be configured to, in a first mode, connect the first charge pump to first circuits of the banks and isolate the second charge pump from the first circuits, and in a second mode, isolate the first charge pump from the first circuits and connect the second charge pump to the first circuits.

A method can include, by operation of a controller circuit, writing data into a volatile memory portion formed in an integrated circuit substrate of a memory device. In response to first conditions, date can be written from the volatile memory portion into a nonvolatile memory portion formed in the same integrated circuit substrate as the volatile memory portion. The nonvolatile memory portion can store the data in two terminal memory elements re-programmable between at least two different resistance states.

Methods of operating integrated circuit devices having volatile and nonvolatile memory portions

A method of controlling an NVM device can include: (i) receiving, by an interface, a write command from a host; (ii) beginning execution of a write operation on a first array plane of a memory array in response to the write command, where the memory array includes a plurality of NVM cells arranged in a plurality of array planes; (iii) receiving, by the interface, a read command from the host; (iv) suspending the write operation in response to detection of the read command during execution of the write operation; (v) beginning execution of a read operation on a second array plane in response to the read command; and (vi) resuming the write operation after the read operation has at least partially been executed.

Concurrent read and write operations in a serial flash device

In one embodiment, a method of operating a resistive switching device includes applying a signal comprising a pulse on a first terminal of a two terminal resistive switching device having the first terminal and a second terminal. The resistive switching device has a first state and a second state. The pulse includes a first ramp from a first voltage to a second voltage over a first time period. The first time period is at least 0.1 times a total time period of the pulse.

Resistive memory device with ramp-up/ramp-down program/erase pulse

A memory device can include a plurality of bit lines; plurality of memory elements coupled to the bit lines, each memory element including a memory layer formed between two electrodes, the memory layer being programmable between a plurality of different resistance states by creation and removal of conductive regions therein by application of electric fields; and at least one sense amplifier (SA) configured to compare a first value, corresponding to a resistance state of a first memory element, to a second value, corresponding to a resistance state of a second memory element.

Memory devices and methods for storing single data value in multiple programmable resistance elements

In one embodiment, a capacitive circuit can include: (i) a resistive storage element having a solid electrolyte, a first electrode coupled to a first side of the solid electrolyte, and a second electrode coupled to a second side of the solid electrolyte; (ii) the resistive storage element being configured to be programmed to a low resistance state by application of a program voltage in a forward bias direction to form a conductive path between the first and second electrodes, and being configured to be erased to a high resistance state by application of an erase voltage in a reverse bias direction to substantially dissolve the conductive path; and (iii) a first capacitor having the first electrode coupled to a first side of a first oxide layer, and a third electrode coupled to a second side of the first oxide layer.

Capacitor arrangements using a resistive switching memory cell structure

Structures and methods of operating a resistive switching memory device are disclosed herein. In one embodiment, a resistive switching memory device can include: (i) a plurality of resistive memory cells, where each of the resistive switching memory cells is configured to be programmed to a low resistance state by application of a first voltage in a forward bias direction, and to be erased to a high resistance state by application of a second voltage in a reverse bias direction; and (ii) a sensing circuit coupled to at least one of the plurality of resistive memory cells, where the sensing circuit is configured to read a data state of the at least one resistive memory cell by application of a third voltage in the forward bias direction or the bias reverse direction.

Sensing data in resistive switching memory devices

Structures and operations of a resistive switching memory device are described herein. In one embodiment, a resistive switching memory device can include: a plurality of resistive memory cells, each configured to be programmed to a low resistance state by application of a first voltage in a forward bias direction, and erased to a high resistance state by application of a second voltage in a reverse bias direction; a plurality of common plates, each being connected to a subset of the resistive memory cells; a command detector configured to detect a write command to be executed as a first and second write operations; and a write controller configured to perform the first write operation on each resistive memory cell in a selected subset, and to perform the second write operation on at least one of the resistive memory cells in the selected subset based on the detected write command.

Common plate switching reduction in resistive switching memory devices

Structures and methods for controlling operation of a programmable impedance element are disclosed herein. In one embodiment, a method of programming/erasing the programmable impedance element can include: (i) receiving a program/erase command to be executed on the programmable impedance element; (ii) generating, in response to the program/erase command, a program/erase pulse for performing a program/erase operation on the programmable impedance element; (iii) generating a time delay from the program/erase pulse, where the time delay includes additional delay to allow for at least partial dissipation of one or more effects caused by the program/erase operation; and (iv) performing, after the time delay has elapsed, a verify operation to determine if the program/erase operation has successfully programmed/erased the programmable impedance element.

Verify pulse delay to improve resistance window

A method can include determining a data value stored in a memory element of a memory cell array based on the length of time required to cause a property of the memory element to change. A memory device can include a plurality of elements programmable into at least two different states; and an electrical bias section that applies sense conditions to a selected element; and a sense section configured to distinguish between the two different states according to whether a change in property occurs in the selected element within a predetermined time under the sense conditions.

Growing community of inventors

Grass Valley, CA, United States of America

Shane Charles Hollmer