Yangtze Memory Technologies Co., Ltd.

Wuhan University

Changjiang River Scientific Research Institute, Changjiang Water Resource Commission

Shan Li

Jianquan Jia

Yali Song

Ying Cui

Kaikai You

Kaiwei Li

Lei Jin

An Zhang

XiangNan Zhao

Hongtao Liu

Xinlei Jia

Xueqing Huang

Jinlong Zhang

Meng Lou

Yuan-Yuan Min

Zhiliang Xia

Wenxi Zhou

Zongliang Huo

Kun Zhang

Linchun Wu

Yuanyuan Min

Jun He

Shuling Huang

Xiuli Ding

Gang Han

Dengxue Liu

Wei Hou

Zhiyu Wang

Yiyan Lu

Yuhong Yan

Zhenzhen Liu

Weijie Li

Yuting Zhang

Peiyang Yu

In some aspects, a memory device is provided. The memory device includes a plurality of memory strings and a peripheral circuit. One of the memory strings includes memory cells, a select transistor coupled to a select line and a bit line, and a dummy cell coupled to a dummy word line and arranged between the select transistor and the memory cells. The peripheral circuit is coupled to the memory strings and configured to, in a pre-pulse period of a program operation, maintain a first voltage on the select line to retain an on-state of the select transistor and apply a second voltage to the dummy word line to turn off the dummy cell. After applying the second voltage to the dummy word line, the peripheral circuit is further configured to apply a third voltage to the select line to turn off the select transistor.

Method of reducing program disturbance in memory device and memory device utilizing same

A memory device includes a memory array including memory strings, each memory string comprising a plurality of first memory cells, a plurality of second memory cells, and one or more dummy memory cells between the first memory cells and the second memory cells. The first memory cells are between drain terminals of the memory strings and the dummy memory cells, and the second memory cells are between source terminals of the memory strings and the dummy memory cells. The bit lines are respectively coupled to drain terminals of the memory strings. The word lines are respectively coupled to gate terminals of the first memory cells and the second memory cells. A word line driver is configured to apply a first voltage signal to each of the word lines that are coupled to the gate terminals of the first memory cells during a pre-charge phase.

Method of performing programming operation and related memory device

A method for operating a memory is disclosed. The memory includes a first group of word lines, a second group of word lines, a first dummy word line, and a second dummy word line. The first dummy word line and the second dummy word line are between the first group of word lines and the second group of word lines. A first pass voltage is applied to the first dummy word line and applying a second pass voltage to the second dummy word line. A program voltage is applied to a selected word line, wherein a condition is met: a first voltage difference between the first pass voltage and a first threshold voltage of a first dummy cell corresponding to the first dummy word line is different from a second voltage difference between the second pass voltage and a second threshold voltage of a second dummy cell corresponding to the second dummy word line.

Method and memory used for reducing program disturbance by adjusting voltage of dummy word line

The invention discloses an experimental system of surrounding rock and lining structure under unequal surrounding pressure and water pressure, comprising: reaction wall, lining structure, external water pressure loading mechanism, internal water pressure loading mechanism, prestress-loading mechanism, surrounding rock layer and monitoring device. The Experimental System can simulate the stress characteristics and related deformation characteristics of the surrounding rock of the tunnel and the lining structure of the water conveyance tunnel under complex internal and external loads in the actual environment, and can help to analyze and study the broken appearance of the lining structure and the crack distribution after cracking.

Experimental system of surrounding rock and lining structure under unequal surrounding pressure and water pressure

Disclosed are a method and equipment for reinforcing a concrete-filled steel tubular column with an outer concrete-filled steel tube. The method includes following steps: step, grinding and derusting an outer wall of a concrete-filled steel tubular column to be reinforced by an auxiliary device; step, welding two prefabricated semi-rectangular steel plates in advance, forming a complete rectangular steel tube with the two semi-rectangular steel plates and sleeving the rectangular steel tube outside the concrete-filled steel tubular column to be reinforced; and step, filling self-compacting concrete between the outer wall of the concrete-filled steel tubular column to be reinforced and an inner wall of the rectangular steel tube to complete a reinforcement.

Method for reinforcing concrete-filled steel tubular column with outer concrete-filled steel tube

Embodiments of 3D memory devices and methods for forming the same are disclosed. In an example, a 3D memory device includes a doped region of a substrate. The doped region includes dopants of a first type. The 3D memory device also includes a semiconductor layer on the doped region. The semiconductor layer includes dopants of a second type. The first type and the second type are different from each other. The 3D memory device also includes a memory stack having interleaved conductive layers and dielectric layers on the semiconductor layer. The 3D memory device further includes a channel structure extending vertically through the memory stack and the semiconductor layer into the doped region, a semiconductor plug extending vertically into the doped region, the semiconductor plug comprising dopants of the second type, and a source contact structure extending vertically through the memory stack to be in contact with the semiconductor plug.

Three-dimensional memory device and method for forming the same

A memory device includes bit lines, and a cell array including strings, each of which includes memory cells, a select cell coupled to a respective one of the bit lines, and a dummy cell between the select cell and the memory cells. The memory device also includes a select line coupled to the select cells, a dummy word line coupled to the dummy cells, word lines each coupled to a respective row of the memory cells, and a controller coupled to the cell array. The controller is configured to drive a voltage on the dummy word line from a first level to a second level lower than the first level. The controller is also configured to drive a voltage on the select line from the first level to the second level, such that the voltage on the select line reaches the second level after the voltage on the dummy word line reaches the second level. The controller is further configured to, after the voltage on the select line reaches the second level, drive a voltage on a selected word line of the word lines from the second level to a third level higher than the first level to program the memory cells coupled to the selected word line.

A memory includes an upper deck and a lower deck. The upper deck includes a first upper dummy word line. The lower deck includes a first lower dummy word line. A method for reducing program disturbance of the memory includes adjusting a first upper bias voltage applied to the first upper dummy word line and/or a first upper threshold voltage of the first upper dummy word line to adjust a first difference between the first upper bias voltage and the first upper threshold voltage; and adjusting a first lower bias voltage applied to the first lower dummy word line and/or a first lower threshold voltage of the first lower dummy word line to adjust a second difference between the first lower bias voltage and the first lower threshold voltage.

A memory device includes a memory array including memory strings. Each memory string includes a plurality of top memory cells, a plurality of bottom memory cells, and one or more dummy memory cells between the top memory cells and the bottom memory cells. The memory device also includes a plurality of word lines respectively coupled to gate terminals of the top memory cells and the bottom memory cells. The memory device further includes a control circuit configured to provide a control signal to control programming a target memory cell of the top memory cells. The gate terminal of the target memory cell are coupled to a selected word line of the word lines. The memory device further includes a word line driver coupled to the control circuit and the word lines and configured to, in response to the control signal, apply a positive first voltage signal to each of the word lines that are coupled to the gate terminals of the top memory cells during a first time period in a pre-charge phase prior to a programming phase.

A vertical NAND string in a channel-stacked 3D memory device may be programmed using ISPP scheme, wherein a preparation step is introduced immediately after each verification step and before the start of a corresponding verification step. During the preparation step, the electrons accumulated in the channel may be drained by the selected bit line for enhancing the coupling effect of the channel, thereby reducing program disturb and increasing program speed.

Method of programming memory device and related memory device having a channel-stacked structure

Embodiments of 3D memory devices and methods for forming the same are disclosed. In an example, a 3D memory device includes a P-type doped region of a substrate, an N-type doped semiconductor layer on the P-type doped region, a memory stack including interleaved conductive layers and dielectric layers on the N-type doped semiconductor layer, a channel structure extending vertically through the memory stack and the N-type doped semiconductor layer into the P-type doped region, an N-type doped semiconductor plug extending vertically into the P-type doped region, and a source contact structure extending vertically through the memory stack to be in contact with the N-type doped semiconductor plug.

A memory device includes a top select cell, a top dummy cell and a string of memory cells. The top select cell has a first terminal coupled to a bit line and a control terminal coupled to a top select line. The top dummy cell has a control terminal coupled to a top dummy word line. The string of memory cells has control terminals coupled to respective word lines. A method operating the memory device includes prior to a program operation, applying a pre-pulse voltage to the top dummy word line, the top select line and the bit line while applying a low voltage to the word lines, and then sequentially applying the low voltage to the top dummy word line, the top select line and the bit line while applying the low voltage to the word lines.

Method of sequentially biasing bias lines in memory device for program disturbance reduction and memory device utilizing same

A memory device includes a memory array including memory strings. Each memory string includes a plurality of top memory cells, a plurality of bottom memory cells, and one or more dummy memory cells between the top memory cells and the bottom memory cells. The memory device also includes a plurality of word lines respectively coupled to gate terminals of the top memory cells and the bottom memory cells, and one or more dummy word lines respectively coupled to gate terminals of the one or more dummy memory cells. The memory device further includes a control circuit configured to program a target memory cell coupled to a selected word line of the plurality of word lines. To program the target memory cell, the control circuit is configured to apply a biased dummy word line pre-pulse signal to the one or more dummy word lines in a pre-charge period prior to a programming period.

Non-volatile memory device and control method

A method of performing a programming operation to a three dimensional (3D) NAND memory device is disclosed. The method makes residual electrons trapped in storage regions of middle dummy memory cells of an unselected string of the 3D NAND memory device to be removed during the pre-charging phase, so as to reduce program disturb to an selected string which neighbors the unselected string.

Growing community of inventors

Wuhan, China

Shan Li