Taiwan Semiconductor Manufacturing Comp. Ltd.

Shan-Ching Lin

Kuen-Ei Chen

Feng-Cheng Kuo

Shao-Yen Ku

Ming-Te Chen

Shang-Yuan Yu

Chi-Fu Yu

Tzu-Yang Chung

Hsiao Chien-Wen

One or more techniques or systems for cleaning wafers during semiconductor fabrication or an associated brush are provided herein. In some embodiments, the brush includes a brush body and one or more inner hole supports within the brush body. For example, a first inner hole support and a second inner hole support define a first inner hole associated with a first size. For another example, a third inner hole support and a fourth inner hole support define a second inner hole associated with a second size different than the first size. In some embodiments, a cleaning solution is applied to a wafer based on a first flow rate at a first brush position and based on a second flow rate at a second brush position. In this manner, a flow field associated with wafer cleaning is provided, thus enhancing cleaning efficiency, for example.

Wafer cleaning

A capacitive sensor assembly for a robot to prevent damage to the robot when it moves in an undesired manner is disclosed. The robot may be used in conjunction with semiconductor fabrication applications. The capacitive sensor assembly can include a hit contact, one or more fixed contacts, one or more damping springs, and a capacitive sensor. The hit contact comes into contact with a barrier as a result of undesired movement by the robot. The damping springs are compressed against the fixed contacts when the hit contact comes into contact with the barrier. The capacitive sensor has a capacitance that changes as the hit contact comes into contact with the barrier. The capacitance of the capacitive sensor is used to detect the robot coming into contact with the barrier, so that damage to the robot can be prevented.

Prevention of robot damage via capacitive sensor assembly

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Pingtung, Taiwan

Shan-Ching Lin