Nxp Usa, Inc.

Nxp B.v.

Shamsuddin Ahmed

Ernst Seler

Ralf Reuter

Ziqiang Tong

Arnaud Sion

Jorn Isaksen

A radar module () comprises a low temperature co-fired ceramic, LTCC, substrate (), with a radar chip () attached to a first surface () of the LTCC substrate () and a transmitting antenna () for transmitting the radar signal attached to a second surface () of the LTCC substrate (). The radar chip () is configured to generate a radar signal for transmission. The transmitting antenna () is configured to communicate with the radar chip () through the LTCC substrate (). The radar module () further comprises a beam steering element () configured to introduce a phase delay to the radar signal in order to adjust a first component of a direction of transmission of the radar signal.

Radar module

A radar system () and a method of operating a radar system are described, the radar system () comprising: a plurality of ICs (), each IC () comprising: a respective LO output () for selectively outputting a respective LO signal, and a respective LO input (); and a coupling device (), the coupling device () comprising: a plurality of inputs (), each input being coupled to the LO output () of a respective IC (), and a plurality of outputs (), each output being coupled to the LO input () of a respective IC (); wherein the coupling device () is configured such that a LO signal arriving at any one of said plurality of inputs () is distributed to each of said plurality of outputs (). The coupling device () may comprise at least one directional coupler.

Radar system comprising coupling device

A transmission line coupling arrangement comprising:

Transmission line coupling system

A device is disclosed. The device includes a baseboard including a first set of metallic contact pads, a semiconductor integrated chip (IC) package including a second set of metallic contact pads and metallic interconnects to connect the first set of metallic contacts pads and the second set of metallic contact pads through metallic interconnects. The second set of metallic contact pads includes a first group of contact pads and a second group of contact pads. The first group of contact pads are designed to carry a high frequency signal. The baseboard includes a plurality of holes that at least partially segregates a first group of metallic interconnects that connects the first group of contact pads to the baseboard and a second group of metallic interconnects that connects the second group of contact pads to the baseboard.

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Munich, Germany

Shamsuddin Ahmed