Abb Technology Ag

Abb Schweiz Ag

Shamsi Ismayilov

In Young Choi

Frantisek Koudelka

Arkady Oksengorn

Yaser A Khalifa

Siu Lau

Hardik Patel

An Intelligent Electronic Device (IED) includes a plurality of hardware modules including a pair of analog input modules (AIM) modules, a Power Supply Module (PSM), and a Binary Input/Output (BIO) module. Each module is configured for mounting in a first IED housing that has a first form factor. The PSM and BIO module are constructed and arranged to directly connect with electrical connections of the first housing. A second IED housing is provided that has a second form factor that is different from the first form factor. The AIM modules are mounted to a bottom panel of the second housing. The PSM and the BIO module are mounted in the second housing. Wiring electrically connects the AIM modules to connections on the second housing. Adaptor structure electrically connects the PSM and the BIO module with associated connections of the second housing.

Mechanical assembly and method to provide form-factor and wire alike adaptation of existing platform hardware modules into new products

A method and apparatus provides an Intelligent Electronic Device (IED) with new hardware modules. Hardware modules are provided that are configured for electrically connecting with connections of a first IED housing that has a first form factor. A second IED housing is provided having a second form factor that is different from the first form factor. The hardware modules are mounted in the second housing. Adaptor structure is employed to electrically connect the hardware modules with connections of the second housing. The second housing is mounted into an existing wiring and second form factor environment.

U form-factor intelligent electronic device (IED) hardware platform with matching of IED wiring, from a non U form-factor IED hardware platform using adapter structure

Intelligent electronic device enclosure

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Conshohocken, PA, United States of America

Shamsi Ismayilov