Alpha Assembly Solutions Inc.

Shamik Ghoshal

Siuli Sarkar

Bawa Singh

Ranjit Pandher

Sutapa Mukherjee

Anubhav Rustogi

Remya Chandran

Poulami Sengupta Roy

Ravindra Mohan Bhatkal

Nirmalya Kumar Chaki

Pavan Vishwanath

V Sathish Kumar

Low pressure sintering powder

Methods for die attachment of multichip and single components including flip chips may involve printing a sintering paste on a substrate or on the back side of a die. Printing may involve stencil printing, screen printing, or a dispensing process. Paste may be printed on the back side of an entire wafer prior to dicing, or on the back side of an individual die. Sintering films may also be fabricated and transferred to a wafer, die or substrate. A post-sintering step may increase throughput.

Sintering materials and attachment methods using same

A sintering powder, wherein a least a portion of the particles making up the sintering powder comprise: a core comprising a first material; and a shell at least partially coating the core, the shell comprising a second material having a lower oxidation potential than the first material.

Multilayered metal nano and micron particles

Growing community of inventors

South Plainfield, NJ, United States of America

Shamik Ghoshal