Applied Materials, Inc.

Other

Adv Antest Corporation

Novellus Systems Incorporated

Gourmeon Inc.

Merz, Michael

Shambhu Nath Roy

Michael Merz

Cheng-Hsiung Matt Tsai

Srinivas D Nemani

Dmitry Lubomirsky

Vijay D Parkhe

Shankar Venkataraman

Soonam Park

Chentsau Chris Ying

Steven Victor Sansoni

Toan Q Tran

Satoru Kobayashi

Tae Seung Cho

Sultan Malik

Jingjing Liu

Vincent Burkhart

Puneet Bajaj

David H Loo

Richard J Green

Ludovic Godet

Ellie Y Yieh

Bart Jan Van Schravendijk

Keith A Miller

David Cohen

Karl M Brown

Martin Lee Riker

Hari K Ponnekanti

Seshadri Ramaswami

Kaihan Abidi Ashtiani

Sanjay Gopinath

Jun Xue

Dhritiman Subha Kashyap

Jie Zhou

Yongmei Chen

Scott Fields

Xiaoyi Huang

Niranjan Kumar

Gautam Pisharody

Natan Solomon

Matt Cheng-Hsiung Tsai

Jason Stevens

Riya Bhattacharya

An electrostatic chucking force tool is described that may be used on workpiece carriers for micromechanical and semiconductor processing. One example includes a workpiece fitting to hold a workpiece when gripped by an electrostatic chucking force by an electrostatic chuck, an arm coupled to the workpiece fitting to pull the workpiece through the workpiece fitting laterally across the chuck, and a force gauge coupled to the arm to measure an amount of force with which the workpiece fitting is pulled by the arm in order to move the workpiece.

Electrostatic chucking force measurement tool for process chamber carriers

A robot vision supervisor system for use with industrial robots being placed with average home consumers or at restaurants that is capable of guiding the robot to its homing position for initial homing or when a loss of reference has occurred. Further the robot vision supervisor is able to detect presence of unidentified foreign objects in the workspace and guide the robot to navigate around and prevent collisions. Image processing algorithms are used with primary, orthogonal and cross camera arrays to increase reliability and accuracy of the robot vision supervisor. Lookup tables of images are captured and stored by controller for discretized positions in the full robot workspace when robot is in known good calibration to compare with images during regular operation for detecting anomalies.

Robot vision super visor for hybrid homing, positioning and workspace UFO detection enabling industrial robot use for consumer applications

A wafer chuck assembly includes a puck, a shaft and a base. An insulating material defines a top surface of the puck, a heater element is embedded within the insulating material, and a conductive plate lies beneath the insulating material. The shaft includes a housing coupled with the plate, and electrical connectors for the heater elements and the electrodes. A conductive base housing couples with the shaft housing, and the connectors pass through a terminal block within the base housing. A method of plasma processing includes loading a workpiece onto a chuck having an insulating top surface, providing a DC voltage differential across two electrodes within the top surface, heating the chuck by passing current through heater elements, providing process gases in a chamber surrounding the chuck, and providing an RF voltage between a conductive plate beneath the chuck, and one or more walls of the chamber.

High temperature chuck for plasma processing systems

A kitchen in a box automatic cooking appliance with various cooking stations and a deep frying station along with selectable lid integrated stirring mechanism with remote stirring power source. Floor and wall mounted ingredient bins and containers along with universal tool carrier to bring in fluidic ingredients to be delivered to cooking stations. Removable components for easy cleaning of the automatic cooking appliance and the components. Heating control by using temperature sensor in contact with cooking vessels by attaching actuator mechanisms on knobs of off the shelf induction and gas stoves.

Kitchen in a box cooking appliance with selectably engaged independent stirring and heating control for a plurality of cooking stations

Methods and apparatus for in-situ plasma cleaning of a deposition chamber are provided. In one embodiment a method for plasma cleaning a deposition chamber without breaking vacuum is provided. The method comprises positioning a substrate on a susceptor disposed in the chamber and circumscribed by an electrically floating deposition ring, depositing a metal film on the substrate and the deposition ring in the chamber, grounding the metal film deposited on the deposition ring without breaking vacuum, and removing contaminants from the chamber with a plasma formed in the chamber without resputtering the metal film on the grounded deposition ring and without breaking vacuum.

In situ plasma clean for removal of residue from pedestal surface without breaking vacuum

A modular robot mechanism utilizing fixed drives, power sources, power delivery cables and electrical components for 4 or more axes in a protective enclosure while making it possible to provide spatial positioning and tilting degrees of freedom to an end effector suitable for using in a consumer product. Furthermore a robotic head mechanism is disclosed that creates additional degrees of freedom or states by combination of existing axes with spring loaded lock mechanisms eliminating need for conventional electrically actuated solenoid or pneumatic grippers making it possible for use as a home appliance. A method to control the robot mechanism and additional axis utilizing a matrix to decouple the input position to the remote actuator and Cartesian motion produced at the end effector.

Multi-axis robot with remote drives facilitating hazardous energy isolation for use by home consumers

Embodiments herein provide apparatus and methods for performing a deposition and a patterning process on a spacer layer with good profile control in multiple patterning processes. In one embodiment, a method for depositing and patterning a spacer layer during a multiple patterning process includes conformally forming a spacer layer on an outer surface of a patterned structure disposed on a substrate, wherein the patterned structure has a first group of openings defined therebetween, selectively treating a first portion of the spacer layer formed on the substrate without treating a second portion of the spacer layer, and selectively removing the treated first portion of the spacer layer.

Apparatus and methods for spacer deposition and selective removal in an advanced patterning process

A dual-plenum showerhead for semiconductor processing operations is provided. The showerhead may include a faceplate with two sets of gas distribution holes, each set fed by a separate plenum. One set of gas distribution holes may be through-holes in the faceplate of the showerhead and may allow gases trapped between the faceplate and a plasma dome to flow towards a wafer. The other set of gas distribution holes may distribute gas routed through passages or channels in the faceplate towards the wafer. The passages or channels in the faceplate may include radial channels and annular channels and may be fed from an annular gas distribution channel about the periphery of the faceplate.

Dual plenum, axi-symmetric showerhead with edge-to-center gas delivery

Methods for making a nanocrystalline diamond layer are disclosed herein. A method of forming a layer can include activating a deposition gas comprising an alkane and a hydrogen containing gas at a first pressure, delivering the activated deposition gas to the substrate at a second pressure which is less than the first pressure, forming a nanocrystalline diamond layer, treating the layer with an activated hydrogen containing gas to remove one or more polymers from the surface and repeating the cycle to achieve a desired thickness.

Remote plasma source based cyclic CVD process for nanocrystalline diamond deposition

A wafer support assembly including a wafer support and cooling plate with radial thermal chokes is provided. The cooling plate and wafer support may have limited contact and may not contact each other outside of certain limited thermal contact patches. The thermal contact patches may generally define one or more radial thermal choke regions. In some implementations, high- and low-temperature cooling systems may be placed at one or more locations across the cooling plate to assist in temperature management.

High temperature electrostatic chuck with radial thermal chokes

A robotic cooking apparatus that can cook dishes using a computer recipe provided by a user and ingredients stored in it. Able to adjust the recipe based on user preference data. Cooking apparatus comprises of ingredient input section, cooking stations, pre-processing and post-processing station. Input section has trays and can be at room temperature or refrigerated for storing perishable ingredients. Robot head assembly is able to transfer ingredients, identify and measure as well as take inventory periodically. Cooking apparatus is connected to a network and can be operated remotely by a fixed or handheld device and monitor its operation remotely.

Robotic kitchen top cooking apparatus and method for preparation of dishes using computer recipies

A method and apparatus for controlling the temperature of a substrate support assembly includes a pedestal, a chuck connected to the pedestal, a cooling plate structure thermally coupled with the chuck, a heater thermally coupled with the cooling plate structure, and a controller configured to control the cooling plate structure while controlling the heater during processing of a substrate on the chuck. The method includes cooling a substrate support with a cooling plate structure while heating the cooling plate structure with a heater thermally coupled with the cooling plate structure, monitoring the performance of the cooling plate structure and the heater, and regulating the performance of the cooling plate structure and the heater to maintain the substrate support at a desired temperature.

Heated cooling plate for E-chucks and pedestals

An electrostatic chuck and method of use thereof is provided herein. In some embodiments, an electrostatic chuck may include a disk having a first side to support a substrate thereon and a second side, opposing the first side, to provide an interface to selectively couple the disk to a thermal control plate, a first electrode disposed within the disk proximate the first side to electrostatically couple the substrate to the disk and a second electrode disposed within the disk proximate the opposing side of the disk to electrostatically couple the disk to the thermal control plate. In some embodiments, the second electrode may also be configured to heat the disk.

Electrostatic chuck and methods of use thereof

Growing community of inventors

San Jose, CA, United States of America

Shambhu Nath Roy