Schott Ag

Shaifullah Bin Mohamed Kamari

Robert Hettler

Amy Soon Li Ping

Matthias Rindt

Thomas Zetterer

Rohit Bhosale

Josef Kiermeier

Lea-Li Chew

George Lin Huikai

Tetsushi Morikawa

A transistor outline package with integrated thermoelectric cooler is disclosed. The thermoelectric cooler is arranged on a heatsink which extends vertically into the housing of the transistor outline package.

Transistor outline package

A housing for radiation-emitting or radiation-receiving optoelectronic components such as LEDs and a method for producing the housing are provided. The housing has a base part and a head part that are joined by a glass layer. The top face of the base part defines an assembly region for an optoelectronic functional element and is also a heat sink for the optoelectronic functional element. The head part extends at least in sections over the peripheral extent of the assembly region, and above the assembly region it forms a passage area for the radiation emitted from or to be received by the optoelectronic functional element.

Housing for high-power LEDs

Growing community of inventors

Singapore, Singapore

Shaifullah Bin Mohamed Kamari