Microelectronics and Computer Technology Corporation

Seyed H Hashemi

Michael A Olla

Thomas P Dolbear

Richard D Nelson

David H Carey

Carroll S Vance

John C Parker

David W Barnes

Claude Rathmell

A process for manufacturing a pin grid array package providing a plurality of electrical input and/or output connections using a plurality of stacked, but spaced apart, separate leadframes which are preformed and include a plurality of electrical leads having first and second ends for providing a plurality of different connections. An insulating layer is positioned between adjacent leadframes and the package is bonded together.

Process for manufacturing a stacked multiple leadframe semiconductor

A three dimensional integrated circuit interconnect for connecting a plurality of chips in a module with a standard footprint for pin grid array or quad flat pack mounting. Each IC is mounted on a custom interconnect slice and tested. The slices are stacked together with electrical connections from one slice layer to the next. The module may use multi-layer ceramic slices or printed circuit board materials.

Method of making three dimensional integrated circuit interconnect module

A process for making thermosetting or thermoplastic encapsulated integrated circuit having a heat exchanger in which one end of the heat exchanger is encapsulated in the housing adjacent to the integrated circuit and the other end is exposed to the environment beyond the housing portion. The process of making includes molding a heat exchanger into a thermosetting or thermoplastic package utilizing a preformed heat exchanger having a dissolvable or removable material which serves as a seal block during the molding operation. A plurality of thermally conductive heat exchanger elements are provided for providing the desired thermal performance while reducing the thermal stresses in the package.

Method for encapsulating an integrated circuit using a removable

An encapsulated integrated circuit package having an integrated circuit chip with a plurality of electrical leads connected thereto and at least one thermally conductive screen mesh positioned adjacent to the chip. A non-electrically conductive thermosetting or thermoplastic material forms a housing enclosing the chip and bonded to the screen mesh. Preferably one of the layers is exposed to the outside of the housing and the screen mesh is secured to a substrate supporting the chip.

Thermally conductive screen mesh for encapsulated integrated circuit

An integrated circuit structure and method of making in which the circuit has a plurality of metal heat exchanger elements spaced from each other with their first ends secured to the structure. The first ends may be adhesively secured to an integrated circuit chip or the underlying substrate, and the heat exchanger may be hermetically attached. The method uses a compliant removable support block for attaching the plurality of individual heat exchanger elements to integrated circuit structures having variations in their elevation.

Integrated circuit structure with heat exchanger elements secured

A capacitor, having an area smaller than the top area of a chip, is attached above the top of a tape-automated-bonded (TAB) chip and short bonded wires or TAB leads interconnect the capacitor electrodes with the power and ground pads on the chip. The interconnections are made as short as possible, with a maximum distance therebetween and with the greatest number which will reduce the inductance of the leads. The power and ground pads may contain inwardly extending bonding regions for wire bonds or flip chip capacitor attachment.

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Austin, TX, United States of America

Seyed H Hashemi