J-solution Co., Ltd.

Seungyong Lee

Disclosed is a by-product collection apparatus which collects a by-product generated during a manufacturing process of manufacturing a semiconductor or a semiconductor-like product. The apparatus includes: a by-product collection module connected to a pipeline in series and configured to collect a by-product from a by-product gas, wherein the by-product gas flows in the pipeline having an inlet pipe and an outlet pipe provided at upper and lower portions of a first casing; and a cooling water supply module including a cooling water tank and a cooling water pump in a second casing and configured to supply and recover cooling water to and from the by-product collection module through a cooling pipe.

Cooling water circulation system-integrated by-product collection apparatus

Disclosed is a gas leakage prevention cooling box for a pipe flange connection, which includes: a main body casing having an inner chamber in which connection flanges of a first pipe and a second pipe are located at a center portion of the main body casing, a pipe mounting hole in which the pipes connected around the flange are located on front and rear sides of the inner chamber, and a first half main body and a second half main body coupled to face to each other with the connection flanges of the first and second pipes therebetween and supported by the connection between the first pipe and the second pipe; and a cooling fan installed in the first half main body of the main body casing and configured to supply external air to the inner chamber.

Gas leakage prevention cooling box for pipe flange connection and gas leakage sensing system

Disclosed is a gas collection apparatus used in manufacturing a semiconductor. The apparatus includes: a housing having a chamber formed therein; a heating member installed in the housing to heat cobalt-carbon gas introduced into the chamber; a cobalt deposition member installed across the chamber of the housing to deposit cobalt composite; and a cooling member that induces carbon composite to be solidified and deposited while rapidly cooling the carbon composite.

Cobalt-carbon gas collection apparatus

The present invention relates to a triple pipe heating device for heating an exhaust gas in a semiconductor and LCD manufacturing process, which has a triple pipe structure capable of effectively heating an exhaust gas with only a small amount of heat without using nitrogen gas, is expandable and bendable so as to be easily installed, and is capable of quickly detecting exhaust gas leakage and overheating.

Growing community of inventors

Hwaseong-si, South Korea

Seungyong Lee