Samsung Display Co., Ltd.

Samsung Electronics Co., Ltd.

Seungwon Park

Un-Byoung Kang

Sang-Uk Han

Baek Hee Lee

Taeje Cho

Moongyu Lee

Baekhee Lee

Junwoo Lee

Minhyuck Kang

Jaebok Chang

Manseob Choi

Junehyuk Jung

Junghoon Song

A quantum dot, a method of preparing the quantum dot, and an optical member and an electronic device, each including the quantum dot, are provided. The quantum dot includes: a core including a Group III-V semiconductor compound alloyed with gallium (Ga); a first shell surrounding the core; and a second shell surrounding the first shell, wherein the first shell includes a first compound that includes a Group II-VI semiconductor compound, a Group III-V semiconductor compound, or a Group III-VI semiconductor compound, the second shell includes a second compound that includes a Group II-VI semiconductor compound, a Group III-V semiconductor compound, or a Group III-VI semiconductor compound, the first compound and the second compound are different from each other, and the atomic percentages of specific elements in a material of the core, elemental ratios in the first shell and second shell with respect to the core satisfy certain ranges.

Quantum dots and preparation method thereof, and optical member and electronic device each including quantum dots

Embodiments of the inventive concepts provide a semiconductor package and a method of fabricating the same. The method includes forming a groove to separate first semiconductor chips from each other. Forming the groove include performing a first sawing process on a bottom surface of a semiconductor substrate to cut the semiconductor substrate and a portion of a mold layer in a direction inclined with respect to the bottom surface, and performing a second sawing process to cut the mold layer in a direction substantially perpendicular to the bottom surface of the semiconductor substrate. A minimum width of the groove formed in the semiconductor substrate by the first sawing process may be greater than a width of the groove formed in the mold layer by the second sawing process.

Semiconductor package and method of fabricating the same

A method for fabricating a display device includes forming a thin film transistor on a base substrate, forming a first electrode connected to the thin film transistor, forming a pixel defining layer overlapping a portion of the first electrode, such that the pixel defining layer exposes a portion of the first electrode and partitions pixel areas, forming a block copolymer layer on the first electrode and the pixel defining layer, patterning the block copolymer layer, etching the pixel defining layer by using the patterned block copolymer layer as a mask, such that an uneven pixel defining layer with a plurality of defining layer grooves is formed, and forming a light emitting layer on the first electrode and the uneven pixel defining layer.

Method for fabricating display device and display device

Growing community of inventors

Seoul, South Korea

Seungwon Park