Samsung Electronics Co., Ltd.

Kpx Chemical Co., Ltd.

Seungwon Kim

Taeyoung Kim

Hoon Hee Han

Yunseok Choi

Moonyoung Kim

Hyojin Yun

Jinhye Bae

Woojung Park

Mintae Lee

Hyunseop Shin

Moonchang Kim

Cheolmo Yang

Hyunwoo Kim

Byung Lyul Park

Su-Jin Kwon

Junwon Han

A photoresist-removing composition includes a polar organic solvent, an alkyl ammonium hydroxide, an aliphatic amine not including a hydroxy group, and a monovalent alcohol. To manufacture a semiconductor device, a photoresist pattern may be formed on a substrate, and the photoresist-removing composition may then be applied to the photoresist pattern. To manufacture a semiconductor package, a photoresist pattern including a plurality of via holes may be formed on a substrate. A plurality of conductive posts including a metal may be formed inside the plurality of via holes, and the photoresist pattern may be removed by applying a photoresist-removing composition of the inventive concept to the photoresist pattern. A semiconductor chip may be adhered to the substrate between the respective conductive posts.

Compositions for removing photoresists and methods of manufacturing semiconductor devices and semiconductor packages using the compositions

A method of manufacturing a semiconductor package, the method including forming a hole that penetrates an interconnect substrate; providing a first carrier substrate below the interconnect substrate; providing a semiconductor chip in the hole; forming a molding layer by coating a molding composition on the semiconductor chip and the interconnect substrate; adhering a second carrier substrate onto the molding layer with an adhesive layer; removing the first carrier substrate to expose a bottom surface of the semiconductor chip and a bottom surface of the interconnect substrate; forming a redistribution substrate below the semiconductor chip and the interconnect substrate; detaching the second carrier substrate from the adhesive layer; and removing the adhesive layer.

Methods of manufacturing semiconductor packages

Growing community of inventors

Hwaseong-si, South Korea

Seungwon Kim