Semes Co., Ltd.

Seoul National University

Seungtae Yang

Buyoung Jung

Gui Su Park

Gi Hun Choi

Jung Hwan Lee

Jae Hong Lee

Ho-Young Kim

Ohyeol Kwon

Sangwoo Park

Soo Young Park

Jun Keon Ahn

Seung Hwan Cho

Yunsuk Jeung

Youngjoon Han

Seonghyeon Kim

Provided is a liquid chemical supply module and a substrate processing apparatus including the same, the liquid chemical supply module including a main supplier for supplying a liquid chemical from a liquid chemical tank to at least one substrate processing apparatus, and at least one distribution supplier for connecting between the main supplier and any one substrate processing apparatus to distribute the liquid chemical supplied through the main supplier to the any one substrate processing apparatus, wherein the distribution supplier includes a distribution line branched from a main line of the main supplier, a first circulation line branched from the distribution line and connecting between the distribution line and the main line, and a second circulation line branched from the distribution line connecting between the distribution line and the main line.

Liquid chemical supply module and substrate processing apparatus including the same

An apparatus and system for treating a substrate includes a chamber having an inner space, a support unit in the inner space and configured to support and rotate the substrate, and first and second laser irradiation unit configured to irradiate first and second laser beams onto the substrate. The first laser irradiation unit includes a first laser light source configured to generate the first laser beam, and a first wavelength adjusting member configured to adjust a range of a wavelength of the first laser beam received from the first laser light source. The second laser beam, and a second wavelength adjusting member configured to adjust a range of a wavelength of the second laser beam received from the second laser light source.

Apparatus and system for treating substrate

An apparatus for processing a substrate includes a housing, a support unit that supports the substrate in the housing, a nozzle that dispenses a processing liquid onto the substrate, and a liquid supply unit that supplies the processing liquid to the nozzle. The liquid supply unit includes a container having a storage space in which the processing liquid is stored, a liquid supply tube through which the processing liquid flows from the container to the nozzle, and an ultrasonic-wave application member that applies ultrasonic waves to the processing liquid before the processing liquid is supplied to the nozzle. The ultrasonic-wave application member includes a liquid reservoir having an interior space in which a liquid is received and an ultrasonic generator that applies ultrasonic waves to the liquid received in the liquid reservoir. Part of the liquid supply tube is immersed in the liquid received in the liquid reservoir.

Liquid supply unit, and apparatus and method for processing substrate

The inventive concept relates to an apparatus for treating a substrate. According to an embodiment, the substrate treating apparatus includes a housing having a process space therein, a support unit that supports the substrate in the housing, a nozzle that dispenses a treatment liquid onto the substrate supported on the support unit, and a liquid supply unit that supplies the treatment liquid to the nozzle, in which the liquid supply unit includes a container having a storage space in which the treatment liquid is stored, a liquid supply tube that causes the treatment liquid to flow from the container to the nozzle, and a microwave applying member that applies microwaves to the treatment liquid before the treatment liquid is supplied to the nozzle.

Liquid supply unit and substrate treating apparatus and method

A method for treating a substrate is provided. The method includes supplying a first treating liquid to a treating target surface of the substrate while the substrate is rotating, and subsequently, supplying a second treating liquid having a surface tension lower than a surface tension of the first treating liquid to the substrate while an evaporation inhibiting agent in a vapor state is present around the first treating liquid supplied to the substrate, such that the first treating liquid on the substrate is substituted with the second treating liquid. Thus, a vapor atmosphere may be formed around a cleaning liquid applied to the substrate. Thus, a liquid-film destroying phenomenon may be prevented in a procedure in which the cleaning liquid is replaced with an organic solvent.

Substrate treating method and substrate treating apparatus

Growing community of inventors

Gyeonggi-do, South Korea

Seungtae Yang