Samsung Display Co., Ltd.

Seungkyun Hong

Hirotsugu Kishimoto

Hee-Kwon Lee

Chul Ho Jeong

Dasom Gu

Sung-Ki Jung

Jaiku Shin

Hyun-Been Hwang

Yongchan Jeon

Sungguk An

Yunjae Kim

Dongho Lee

Sohra Han

Yonghyuck Lee

Jeongil Yoo

Hyunjun Cho

An electronic device includes a display panel having a folding region, which is foldable with respect to a folding axis extending in one direction, and a first non-folding region and a second non-folding region spaced apart from each other with the folding region therebetween, and a lower member disposed below the display panel. The lower member includes a support layer disposed below the display panel, where the support layer includes a first support portion overlapping the first non-folding region, and a second support portion overlapping the second non-folding region, and a digitizer disposed below the display panel and corresponds to the first support portion and the second support portion. The first support portion and the second support portion each independently include a reinforcement fiber, where the reinforcement fiber includes an aramid fiber or includes a carbon fiber and a glass fiber.

Foldable electronic device including support layer including reinforcement fiber

A chip-on-film package includes a base substrate on which a first pad region, a second pad region, and a third region located between the first pad region and the second pad region are defined, a dummy pad disposed on the first pad region, input pads disposed on the first pad region, output pads disposed on the second region, a first detection line disposed on the base substrate, and a second detection line disposed on the base substrate. The first detection line is connected to a first input pad and a second input pad via the second pad region to form a first loop between the first input pad and the second input pad, and the second detection line is connected to the dummy pad and the first detection line via the third region to form a second loop between the dummy pad and the first input pad.

Chip-on-film package, display panel, and display device

A digitizer includes a folding area a non-folding area. The digitizer includes a first base layer, a second base layer disposed on the first base layer, a third base layer disposed on the second base layer, a first sensing line disposed between the first base layer and the second base layer, and a second sensing line substantially perpendicular to the first sensing line, disposed between the second base layer and the third base layer, and including a first sub-line portion and a second sub-line portion disposed in the non-folding area, and a third sub-line portion disposed between the first sub-line portion and the second sub-line portion and corresponding to the folding area. The third sub-line portion has a fracture strain greater than a fracture strain of the first sub-line portion and the second sub-line portion.

Digitizer and display device including the same

An electronic apparatus includes a display panel having non-folding areas arranged along a first direction, and a folding area disposed between the non-folding areas and folded along an imaginary folding axis extending in a second direction crossing the first direction, a lower protective film disposed below the display panel, a detection sensor disposed below the protective film, and a lower member disposed below the detection sensor. The detection sensor includes a digitizer including first sensing coils and second sensing coils, which are insulated and spaced apart from each other, and a shielding layer disposed below the digitizer. The shielding layer overlaps the folding area and a shielding opening is defined through the shielding layer.

Electronic apparatus and method for manufacturing the same

An electronic apparatus includes a display module divided into a first non-folding area, a folding area foldable along an imaginary folding axis extending in a second direction crossing a first direction, and a second non-folding area, which are sequentially arranged in the first direction, and a sensing sensor including a first base layer disposed under the display module, first sensing coils disposed on the first base layer, second sensing coils insulated from the first sensing coils, and a first cover layer disposed between the first sensing coils and the second sensing coils. The first cover layer has a modulus less than a modulus of the first base layer.

Electronic apparatus

Growing community of inventors

Cheonan-si, South Korea

Seungkyun Hong