Samsung Electronics Co., Ltd.

Seungjun Shin

Taeyoung Oh

Su Yeon Doo

Bonghyun Choi

Siwan Kim

Dokwan Oh

Younghun Seo

Tae Young Oh

Yeonkyu Choi

Suji Kim

DongHyeok Cho

Yeongwoo Kang

Disclosed is a memory device which includes a first memory cell that is electrically connected with a first word line and a first bit line, a first bit line sense amplifier circuit that is electrically connected with the first bit line, a first local sense amplifier circuit that is electrically connected with the first bit line sense amplifier circuit through a first local input/output line, a first local driver that is electrically connected with the first local sense amplifier circuit through a first pre-global input/output line, and a sense amplifier and write driver that is electrically connected with the first local driver through a global input/output line, and the first local driver selectively electrical-disconnects the first pre-global input/output line from the global input/output line, based on an operation for the first memory cell.

Memory device

A semiconductor device includes a lower structure, a stack structure on the lower structure and extending from a memory cell region into a connection region, gate contact plugs on the stack structure in the connection region, and a memory vertical structure through the stack structure in the memory cell region, wherein the stack structure includes interlayer insulating layers and horizontal layers alternately stacked, wherein, in the connection region, the stack structure includes a staircase region and a flat region, wherein the staircase region includes lowered pads, wherein the flat region includes a flat pad region, a flat edge region, and a flat dummy region between the flat pad region and the flat edge region, and wherein the gate contact plugs include first gate contact plugs on the pads, flat contact plugs on the flat pad region, and a flat edge contact plug on the flat edge region.

Semiconductor device with stacked structure

An electronic device extracts feature data from an input image, calculates one or more class maps from the feature data using a classifier layer, calculates one or more cluster maps from the feature data using a clustering layer, and generates image segmentation data using the one or more class maps and the one or more cluster maps.

Image segmentation method and device

A three-dimensional (3D) semiconductor memory device includes electrode structures including a plurality of electrodes stacked on a semiconductor substrate, and the electrode structures extend in a first direction and are spaced apart from each other by separation regions in a second direction perpendicular to the first direction. The 3D semiconductor memory device includes ground select gate electrodes comprising lowermost electrodes among the plurality of electrodes of the electrode structures, wherein on a level of the ground select gate electrodes, the separation regions include a first end portion, and at least one ground select gate cutting region overlaps the first end portion of the separation regions and electrically isolates the ground select gate electrodes from each other.

Three-dimensional semiconductor memory devices

A vertical memory device includes a cell stacked structure, a wiring connection structure, and a first insulating interlayer. The cell stacked structure may include insulation layers and gate patterns repeatedly and alternately stacked on a first region of a substrate. The wiring connection structure may contact side walls of the cell stacked structure. The wiring connection structure may include a first staircase structure having one side of a stepped shape, a second staircase structure having one side of a stepped shape and disposed below the first staircase structure, and a first dummy staircase structure between the first and second staircase structures. The first and second staircase structures may be spaced apart from each other in the first direction, and both sides in the first direction of the first dummy staircase structure may have stepped shapes. The first insulating interlayer may be on the substrate to cover the wiring connection structure.

Vertical memory devices

Semiconductor device including stack structure with flat region

A semiconductor memory device includes a command decoder configured to generate an auto-sync signal in response to a command for writing data at a memory cell or reading data from a memory cell, and an internal data clock generating circuit configured to phase synchronize a second clock, having a clock frequency higher than a clock frequency of a first clock, with the first clock in response to the auto-sync signal.

Semiconductor memory device having clock generation scheme based on command

An exemplary embodiment includes a method of controlling a semiconductor device. The semiconductor device includes a memory cell array including a plurality of memory cells connected between a plurality of word lines and a plurality of bit lines, a row decoder for receiving a row address and selecting a word line corresponding to the row address, a column decoder for receiving a column address and selecting a bit line corresponding to the column address, a sense amplifier for reading data stored in a memory cell connected to the selected word line and the selected bit line, and a data output driver. The method includes setting a calibration code for a driver control code, to control an initial current strength of the data output driver, and changing the calibration code to change the driver control code during a read or write operation for the memory cell array.

Semiconductor device and method of operating and controlling a semiconductor device

A training method for a memory device includes providing, at a memory controller, a clock signal to the memory device to synchronize a control signal at a reference time point of the clock signal. When the clock signal, such as a training clock signal, does not transition after the reference time point, a failure time point is found at which the memory device fails to sample the control signal at the reference time point, based on the clock signal and the control signal. A synchronization time point of the control signal may be set, at which the memory device secures a sampling margin for sampling the control signal at the reference time point, based on the failure time point. A sampler circuit may sample the control signal at an edge of a rising edge of the clock signal.

Growing community of inventors

Incheon, South Korea

Seungjun Shin