Samsung Electronics Co., Ltd.

Seungbin Baek

Yanggyoo Jung

Hyunjung Song

Jisun Yang

Sangmin Yong

Provided is a semiconductor package including a first wiring pad on a package substrate; a first wiring connection part on the first wiring pad and including a wiring solder layer; a second wiring pad on the package substrate; a second wiring connection part on the second wiring pad and including a conductor; an interposer substrate on the first wiring connection part and the second wiring connection part, wherein a first substrate connection part and a second substrate connection part respectively electrically connected to the first wiring connection part and the second wiring connection part are arranged on a rear surface of the interposer substrate; and semiconductor chips apart from each other in a two-dimensional manner on the interposer substrate, wherein each of the semiconductor chips is electrically connected to the interposer substrate via a chip connection pillar.

Semiconductor package having interposer substrate

A semiconductor package includes: a package substrate; an interposer disposed on the package substrate; a first semiconductor chip mounted on the interposer; a second semiconductor chip mounted on the interposer adjacent to the first semiconductor chip, the second semiconductor chip having an overhang portion that does not overlap the interposer in a vertical direction; a first underfill disposed between the package substrate and the interposer, the first underfill having a first extension portion extending from a side surface of the interposer; a second underfill disposed between the interposer and the second semiconductor chip, the second underfill having a second extension portion extending to an upper surface of the package substrate along at least a portion of the first extension portion of the first underfill, wherein the second extension portion protrudes from the overhang portion contact the upper surface of the package substrate.

Growing community of inventors

Suwon-si, South Korea

Seungbin Baek