Semes Co., Ltd.

Samsung Electronics Co., Ltd.

Seungbae Lee

Doo Ho Lim

Chang-Seung Ha

Jun Pyo Hong

Soojae Park

Jin-Kyu Choi

Sangsu Ha

Ki Yung Lee

Wonhaeng Lee

Hyunsuk Chun

Provided is an apparatus for treating a substrate. The substrate treating apparatus includes a substrate supporting unit for supporting the substrate and fixing the substrate with electrostatic force, a plasma generating unit for generating a discharging plasma for discharging a charge of the substrate, and a power supplying unit for supplying power to the substrate supporting unit and the plasma generating unit, wherein the power supplying unit supplies power of a fluctuating pattern to the plasma generating unit when a charge of the substrate is discharged.

Apparatus and method for treating substrate

An embodiment includes a support unit, substrate treating apparatus and substrate treating method. The substrate treating apparatus comprises: a process chamber having a treatment space inside thereof; a support unit for supporting a substrate inside of the process chamber; and a gas supply unit for supplying the treatment gas into the treatment space, wherein the support unit comprises: an electrode layer of a metal material to which a high frequency electric power can be applied; a ground line having one end connected to the electrode layer and the other end grounded; and a switch provided on the ground line.

Support unit, apparatus and method for treating a substrate

Provided is a semiconductor package including a wiring substrate having top and bottom surfaces. A first semiconductor chip is disposed on the wiring substrate in a flip-chip manner. The first semiconductor chip has a first surface facing the top surface of the wiring substrate and a second surface opposite to the first surface. First connection members are disposed between the wiring substrate and the first semiconductor chip. The first connection members include first and second contact members each including one or more magnetic materials. The first contact members include portions disposed in the second contact members. The one or more magnetic material of the first contact members have an opposite polar orientation to that of the second contact members.

Semiconductor package having magnetic connection member

Provided is a substrate supporting unit, which includes a support plate on which a substrate is placed, and a heating member disposed within the support plate to heat the support plate. The heating member includes a plurality of first heating wires disposed in a first region of the support plate, and a plurality of second heating wires disposed in a second region of the support plate, which is different from the first region. The first heating wires are connected to each other through one of a series connection and a parallel connection, and the second heating wires are connected to each other through the other of the series connection and the parallel connection.

Substrate supporting units and substrate treating apparatuses including the same

Mounted on the body of a fan blade is a micro-electro mechanical system which includes at least one thin silicon film forming an integrated circuit, and an actuator connected to the circuit for generating vibrations. If used as a noise-killing system, the actuator generates vibrations which offset (reduce) unstable air flows along the blade body. If used in a heat exchanger to improve the heat exchange effect, the system generates vibrations which amplify the unstable air flow, e.g., to amplify turbulence and vortexes.

Noise killing system of fans

A structure of a ventilation fan provided with a plurality of blades has a performance curve characterized by a gentle slope throughout the wide operating range instead of an S-hysteresis curve, in order to overcome a fluctuation phenomena of the operating flow rate. The blade tip cross-section lies on a first imaginary cylindrical surface and an angle of attack and pitch angle of the blade tip are formed as respective trajections by intersecting the first cylindrical surface by a second cylindrical surface whose center axis has been rotated about two axes.

Growing community of inventors

Gyeonggi-do, South Korea

Seungbae Lee