Lg Electronics Inc.

Samsung Electronics Co., Ltd.

Lg Innotek Co., Ltd.

Gwangju Institute of Science and Technology

Lg Innotek

Seung Yeob Lee

Geun Ho Kim

Yu Ho Won

Hyun Jun Kim

Sung Jae Yang

Kun Sun Eom

Myoung Hoon Jung

Sang Hyeon Yoon

Alexander Zhbanov

Ye Sung Lee

Jong Won Seo

Byung Jun Kim

An apparatus for analyzing an in vivo component is provided. The apparatus for analyzing an in vivo component may include an impedance sensor including a first electrode and a second electrode configured to contact a fluid channel of a fluid to be analyzed. The apparatus may include an impedance measurement device configured to apply a current to the first electrode and the second electrode, measure a voltage between the first electrode and the second electrode based on applying the current, and measure an impedance of the fluid based on the measured voltage. The apparatus may include a processor configured to model the measured impedance using an equivalent circuit; and analyze the in vivo component based on modeling the measured impedance using the equivalent circuit.

Apparatus and method for analyzing in vivo component and impedance measuring apparatus

A light emitting device package capable of achieving an enhancement in light emission efficiency and a reduction in thermal resistance, and a method for manufacturing the same are disclosed. The method includes forming a mounting hole in a first substrate, forming through holes in a second substrate, forming a metal film in the through holes, forming at least one pair of metal layers on upper and lower surfaces of the second substrate such that the metal layers are electrically connected to the metal film, bonding the first substrate to the second substrate, and mounting at least one light emitting device in the mounting hole such that the light emitting device is electrically connected to the metal layers formed on the upper surface of the second substrate.

Light emitting device package and method for manufacturing the same

Disclosed is a method and system for transmitting a haptic function within a communication system. The method includes: inserting, by a first mobile terminal, haptic information corresponding to a selected vibration into a call setup request message and transmitting the call setup request message to a network server when a haptic service is executed; analyzing, by the network server, the haptic information, generating a vibration code corresponding to the haptic information, inserting the vibration code into the call setup request message, and transmitting the call setup request message to at least one second mobile terminal; and executing, by the second mobile terminal, a corresponding haptic function according to the vibration code included in the call setup request message when receiving the call setup request message.

Method for transmitting a haptic function in a mobile communication system

The present invention relates to a light emitting device package and a method for manufacturing the same. The present invention has advantages in that a light emitting device is electrically connected to other devices without use of wire bonding, thereby saving a space for wire bonding and reducing the size of a package.

Growing community of inventors

Gyeonggi-do, South Korea

Seung Yeob Lee