Samsung Electro-mechanics Co., Ltd.

Seung Woo Song

Jin Kyung Joo

Taek Jung Lee

Min Gon Lee

Jin Man Jung

Sung Kwon An

Hyo Youn Lee

Sang Soo Park

Woo Chul Shin

Jong Pil Lee

Jae Yeol Choi

Ji Hyun Park

Won Young Lee

Jong Bong Lim

A multilayer ceramic electronic component includes: a ceramic body and first and second external electrodes on external surfaces of the ceramic body. The ceramic body includes first and second internal electrodes facing each other with dielectric layers interposed therebetween. The ceramic body includes an active portion in which capacitance is formed and cover portions on upper and lower surfaces of the active portion, respectively. The ratio of the thickness of the first and second external electrodes to the thickness of the cover portion is proportional to the inverse of the cube root of the ratio of the Young's Modulus of each of the first and second external electrodes to the Young's modulus of the cover portion.

Multilayer ceramic electronic component

A multilayer ceramic electronic component includes a ceramic body including a dielectric layer, and a first internal electrode and a second internal electrode facing each other with the dielectric layer interposed therebetween, and a first external electrode electrically connected to the first internal electrode, and a second external electrode electrically connected to the second internal electrode, disposed in an outer portion of the ceramic body, the first and second external electrodes comprise a first electrode layer including a conductive metal, a first plating layer disposed on the first electrode layer and including nickel (Ni), and a second plating layer disposed on the first plating layer and including tin (Sn), and a ratio (t/t) is within a range from 1.0 to 9.0, where tis a thickness of the first plating layer including nickel (Ni), and tis a thickness of the second plating layer including tin (Sn).

A multilayer ceramic electronic component includes a multilayer ceramic electronic component including a ceramic body including a dielectric layer, and a first internal electrode and a second internal electrode facing each other with the dielectric layer interposed therebetween, and first and second external electrodes respectively electrically connected to the first and second internal electrodes, disposed in an outer portion of the ceramic body. The first and second external electrodes include a first electrode layer including a conductive metal, a first plating layer disposed on the first electrode layer and including nickel (Ni), and a second plating layer disposed on the first plating layer and including tin (Sn). A ratio (t1/t2) between a thickness (t1) of the first plating layer including nickel (Ni) and a thickness (t2) of the second plating layer including tin (Sn) is within a range from 1.0 to 9.0.

A capacitor component includes a body including a dielectric layer, and a first internal electrode and a second internal electrode opposing each other in a first direction of the body with the dielectric layer interposed therebetween, and having first and second surfaces opposing each other in the first direction, third and fourth surfaces connected to the first and second surfaces and opposing each other in a second direction of the body, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other in a third direction of the body, and first and second external electrodes disposed in the body and connected to the first and second internal electrodes, respectively. The body has edges having a rounded shape.

Capacitor component

A capacitor component includes a body including an active layer and an upper cover and a lower cover disposed on an upper part and a lower part of the active layer, respectively; first internal electrodes and second internal electrodes disposed inside the active layer; a first active via and a second active via extending in a thickness direction of the active layer to be connected to the first and second internal electrodes, respectively; first and second cover vias extending in a thickness direction of the lower cover to be electrically connected to the first and second active vias and disposed at an interval narrower than an interval between the first and second active vias; and first and second lower electrodes disposed in a lower surface of the lower cover to be connected to the first and second cover vias, respectively.

A multilayer ceramic capacitor includes a capacitive portion, a protective part, and first and second connecting electrodes. The capacitive portion includes a first dielectric layer and first and second internal electrodes disposed with the first dielectric layer interposed therebetween. The protective part is disposed on one surface of the capacitive portion and includes a second dielectric layer and first and second electrode patterns disposed to be spaced apart from each other. The first connecting electrode penetrates through the protective part and the capacitive portion and is connected to the first internal electrode and the first electrode pattern, and the second connecting electrode penetrates through the protective part and the capacitive portion and is connected to the second internal electrode and the second electrode pattern.

Multilayer ceramic capacitor and method of manufacturing the same

A multilayer ceramic capacitor includes a body a first internal electrode and a second internal electrode disposed with a dielectric layer interposed therebetween, a first connecting electrode connected to the first internal electrode through the body, a second connecting electrode connected to the second internal electrode through the body, a first external electrode disposed on one surface of the body and connected to the first connecting electrode, and a second external electrode disposed on one surface of the body, spaced apart from the first external electrode, and connected to the second connecting electrode, wherein the first and second external electrodes each include a first electrode layer disposed on the body and including ceramics, and a second electrode layer disposed on the first electrode layer and having the content of ceramics smaller than that of the first electrode layer.

A multilayer capacitor and a board having the same provide high capacitance and low equivalent series inductance (ESL). The multilayer capacitor includes a capacitor body including an active region, including first and second internal electrodes, and first and second cover regions. Third and fourth internal electrodes are alternately disposed in the cover region adjacent to a mounting surface. First and second external electrodes respectively contact the first and second internal electrodes to provide capacitance. First and second via electrodes are disposed in the cover region, where the first via electrode connects the third internal electrode and a first band portion of the first external electrode to each other, and where the second via electrode connects the fourth internal electrode and a second band portion of the second external electrode to each other.

Multilayer capacitor and board having the same

A multilayer ceramic electronic component includes a ceramic body including a dielectric layer, and a first internal electrode and a second internal electrode facing each other with the dielectric layer interposed therebetween, and a first external electrode electrically connected to the first internal electrode, and a second external electrode electrically connected to the second internal electrode, disposed on an outer surface of the ceramic body. Each of the first and second external electrodes includes a first electrode layer including a conductive metal and a plating layer disposed on the first electrode layer. The first electrode layer extends beyond the plating layer on the ceramic body, and includes a first area covered by the plating layer, and a second area extending from the first area, and an insulating layer covers the second area.

A resistor element includes a substrate having first and second surfaces facing each other, and a plurality of side surfaces connecting the first surface and the second surface with each other. A resistance layer is on at least one of the first and second surfaces. A first terminal and a second terminal are connected to the resistance layer, and each include a first electrode layer on the first surface, a second electrode layer on the second surface, and a plurality of side electrode layers on at least a portion of the plurality of side surfaces. At least a portion of the side surfaces of the substrate is exposed between side electrode layers of the first terminal.

Resistor element

A multilayer ceramic capacitor includes: a capacitance layer including dielectric layers and first and second internal electrodes disposed with respective dielectric layers interposed therebetween; a protection layer disposed on one surface of the capacitance layer; an alpha connection electrode provided in an alpha via penetrating through the protection layer; and a beta connection electrode provided in a beta via penetrating through the capacitance layer and connected to the alpha via. The alpha via has a diameter greater than that of the beta via.

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Suwon-si, South Korea

Seung Woo Song