Samsung Electronics Co., Ltd.

Hynix Semiconductor Inc.

Seung-Woo Shin

Chang-Soo Lee

Chang-soo Lee

Giang-yoon Kwon

So-young Park

Tae-won Eom

Hyung-Joo Jin

Kyung-Dae Park

Jeong-Hwan Kim

Dong-jae Lee

Sang-chul Lee

Do-kwan Oh

Gil-heyun Choi

Ki-Hyun Kim

Byung-Lyul Park

Kwon Hong

Jong-myeong Lee

Jong-Ho Yun

Sung-Jin Whang

Jin-Gyu Seo

Moon-Sig Joo

Byeong-seob Ko

Yong-Jun Lim

Keum-Hee Ma

Sang-Chul Lee

Son-Kwan Hwang

Min-Seung Yoon

Yong-Seok Eun

Jong-ho Yun

Sang-hyun Shin

Sun-Young Yi

Ui-hyoung Lee

Giang-Yoon Kwon

Kum-Hyun Cho

Kyoung-Eun Chang

Dong-Jae Lee

Bo-Min Seo

Se-an Kwon

Tae-Won Um

Myoung-Hwan Han

Hyuk Namkoong

Je-Heon Park

Tae-Won Eom

So-Young Park

Do-Kwan Oh

Byeong-Cheol Hwang

Disclosed is an electronic device. The disclosed electronic device may include: a first sensor and a second sensor; a display configured to display a user interface; and a processor electrically connected with the first sensor, the second sensor, and the display, in which the processor is configured to change a first user interface displayed on the display to a second user interface displayed adjacent to a position of the second sensor and to display the second user interface, based on a result of detection by the first sensor.

Electronic device and control method thereof for changing user interface when device is under water

A flexible display apparatus is provided. The flexible display apparatus includes a display unit, a sensor configured to sense a bending of the flexible display apparatus, and a controller configured to display first contents on a first screen of the display unit, and to reconfigure and display the first contents on a second screen generated on an area of the display unit based on the bending.

Flexible display apparatus and controlling method thereof

An X-ray apparatus includes: a source configured to emit X-rays to an object; a detector configured to detect the X-rays that have penetrated the object; an arm configured to connect the source to the detector and move centering on a stand fixed to a bottom; a controller configured to control a movement of the arm so that the controller changes a direction of the X-rays, which are radiated to the object, and the arm rotates on the stand to move the detector in a first direction, to obtain images for a plurality of parts of the object; and an image processor configured to obtain the images for the plurality of parts of the object based on the X-rays detected by the detector.

X-ray apparatus and method of capturing X-ray image

A method for fabricating a semiconductor device, including forming gate patterns over a substrate, forming conductive layer covering top and sidewalls of each gate pattern, forming a metal layer for a silicidation process over the conductive layer, and silicifying the conductive layer and the gate patterns using the metal layer.

Method for fabricating semiconductor device

An X-ray apparatus includes: a source for emitting X-rays to an object; a detector for detecting the X-rays penetrating the object; an arm for connecting the source to the detector and moving the detector up and down according to a rotation of the source; and a controller for controlling an imaging of the object by driving the arm.

X-ray apparatus and method of obtaining X-ray image

A method and apparatus for error concealment in image data including a block having an error, the method including: dividing a region that surrounds the block into a plurality of neighboring regions; separately calculating edge angles of the neighboring regions; and selectively performing directional interpolation based on the calculated edge angles.

Method and apparatus for spatial error concealment of image

An apparatus is capable of restoring a clock of a second node in a communication system with a symmetric network construction of a first node that is capable of receiving a Global Positioning System (GPS) signal, and the second node that is not capable of receiving a GPS signal. The method includes identifying synchronization information received from the first node, determining a delay with the first node, generating a clock using the synchronization information and delay, removing a clock phase being out of a reference range in a phase identification interval, dividing the phase identification interval into at least two subdivision intervals, and removing a clock phase being out of a normal operation range of a phase in each subdivision interval.

Apparatus and method for timing synchronization in a communication system

A method and system to provide a blog by using a mobile terminal, and a mobile blog (MB) caster therefor, the method including: receiving blog data including one or more pieces of downsized data from an MB caster; selecting a piece of downsized data from among the one or more pieces of downsized data; obtaining metadata corresponding to the selected piece of downsized data; accessing a web blog server; and downloading original data corresponding to the metadata from the web blog server. Since the blog is created and provided by using the downsized data, instead of the original data, a blog server operation can be realized by using only existing mobile devices. Furthermore, the mobile terminal does not have to be connected to the Internet (or the web blog server) for a blog service. Also, it is possible to provide the blog at very high speed.

Method and system for providing blog service by using mobile terminal, and mobile blog caster therefor

A semiconductor device includes a semiconductor chip having a top surface on which a first conductive pad is disposed, a bottom surface opposite to the top surface, and a side surface connecting the top and bottom surfaces to each other, a first reinforcement layer on the top surface of the semiconductor chip, a first absorption layer between the top surface of the semiconductor chip and the first reinforcement layer to absorb a stress resulting from a difference in thermal expansion coefficient between the first reinforcement layer and the semiconductor chip, and a connection terminal disposed on the first reinforcement layer and electrically connected to the first conductive pad.

Semiconductor device

A microelectronic device structure as provided herein includes a conductive via having a body portion extending into a substrate from an upper surface thereof and a connecting portion laterally extending along the upper surface of the substrate. The connecting portion includes a recess therein opposite the upper surface of the substrate. The recess is confined within the connecting portion of the conductive via and does not extend beneath the upper surface of the substrate. A microelectronic device structure is also provided that includes a conductive via having a body portion extending into a substrate from an upper surface thereof and an end portion below the upper surface of the substrate. The end portion has a greater width than that of the body portion. A solder wettable layer is provided on the end portion. The solder wettable layer is formed of a material having a greater wettability with a conductive metal than that of the end portion of conductive via. Related methods of fabrication are also discussed.

Through-silicon via structures providing reduced solder spreading and methods of fabricating the same

Provided are a server and client for determining error restoration according to image data transmission, and a method thereof. The server includes a forward error correction (FEC) mode performer to output image data in which a redundant bit for error correction is added, an automatic repeat request (ARQ) mode performer to outputs the image data after receiving a response signal according to a data reception from a client that receives the image data, a mode determiner to determine whether to operate in an FEC mode or an ARQ mode so that error restoration is performed on the image data according to a reception buffering capacity of the client in regard to image data, and an interface to transmit image data outputted from the FEC mode performer or the ARQ mode performer to the client.

Server and client for determining error restoration according to image data transmission, and method of determining error restoration according to image data transmission

According to an example embodiment, a semiconductor chip package includes a substrate comprising a substrate body having a first main surface, a second main surface, and a cavity that defines an opening in the first main surface, and a layer of electrically conductive material integral with the substrate body. The layer of electrically conductive material constitutes an interconnection pattern of the substrate. The semiconductor chip packages further includes a semiconductor chip disposed within the cavity and mounted to the substrate. The chip includes electrical contacts in the form of pads and the pads face in a direction towards the bottom of the cavity such that the chip has a flip-chip orientation with respect to the substrate. The pads are electrically conductively bonded to respective portions of the interconnection pattern.

Semiconductor chip package, stacked package comprising semiconductor chips and methods of fabricating chip and stacked packages

Provided is a semiconductor device including a fuse, in which a insulating layer surrounding the fuse or metal wiring is prevented from being damaged due to the cut of a fuse, which can occur when a repair process is performed. The semiconductor device includes a conductive line formed on a semiconductor layer, a protective layer formed on the conductive line, one or more fuses that are electrically connected to the conductive line, and a fuse protective layer formed on the one or more fuses, and spaced apart from the protective layer.

Semiconductor device including fuse

Growing community of inventors

Yongin-si, South Korea

Seung-Woo Shin