Average Co-Inventor Count = 3.20
ph-index = 7
The patent ph-index is calculated by counting the number of publications for which an author has been cited by other authors at least that same number of times.
Company Filing History:
1. Asm IP Holding B.v. (12 from 1,130 patents)
2. Hyundai Motor Company (8 from 18,523 patents)
3. Samsung Electronics Co., Ltd. (7 from 131,214 patents)
4. Asm Genitech Korea Ltd. (6 from 25 patents)
5. Kia Motors Corporation (4 from 8,087 patents)
6. Hyperconnect Inc. (2 from 71 patents)
7. Hyundai Ep Co., Ltd. (1 from 3 patents)
8. Hanwha Compound Corporation (1 from 2 patents)
9. Kyungshin Cable Co., Ltd. (1 from 1 patent)
10. Taesung Electro-circuit Systems (1 from 1 patent)
11. Dym Co., Ltd. (1 from 1 patent)
35 patents:
1. 12283267 - Speech synthesis apparatus and method thereof
2. 12270118 - Substrate supporting plate, thin film deposition apparatus including the same, and thin film deposition method
3. 12230531 - Substrate supporting apparatus, substrate processing apparatus including the same, and substrate processing method
4. 11965262 - Substrate supporting plate, thin film deposition apparatus including the same, and thin film deposition method
5. 11854536 - Keyword spotting apparatus, method, and computer-readable recording medium thereof
6. 11753542 - Thermoplastic resin composition
7. 10876218 - Substrate supporting plate, thin film deposition apparatus including the same, and thin film deposition method
8. 10867786 - Substrate processing method
9. 10793698 - Thermoplastic composite resin composition for shielding electromagnetic waves
10. 10442927 - Flame-retardant polyphenylene ether resin composition having high rigidity and high impact strength
11. 10438965 - Semiconductor device and manufacturing method thereof
12. 10395921 - Method of forming thin film
13. 10366807 - Resin composition for automotive cable material and cable using the same
14. 10032792 - Semiconductor device and manufacturing method thereof
15. 9970617 - Copper clad laminate for vehicle LED lamp, printed circuit board including the same, and manufacturing method thereof