Fairchild Korea Semiconductor Ltd.

Seung-Won Lim

Eun-Ho Lee

Gi-Young Jeun

O-Seob Jeun

O-seob Jeon

Seung-Yong Choi

Gi-young Jeon

Eul-bin Im

Byeong Gon Kim

Seung-jin Kim

A semiconductor power module includes a lead frame having a first portion at a first level, a second portion surrounding the first portion at a second level, and a plurality of terminals connected to the second portion. The semiconductor power module further includes a power circuit mounted on a first surface of the first portion and an insulator having an electrically insulating property and thermal conductivity. The insulator has a first surface adjacent to a second surface of the first portion, and a second surface opposite to the first surface of the insulator and exposed to the outside. The semiconductor power module further includes a sealer having an electrically insulating property that covers the power circuit.

Semiconductor power module having an electrically insulating heat sink and method of manufacturing the same

A semiconductor power module includes a lead frame having a first portion at a first level, a second portion surrounding the first portion at a second level, and a plurality of terminals connected to the second portion. The semiconductor power module further includes a power circuit mounted on a first surface of the first portion and an insulator having an electrically insulating property and thermal conductivity. The insulator is adjacent to a second surface of the first portion of the lead frame. The semiconductor power module further includes a sealer having an electrically insulating property that covers the power circuit and the control circuit.

A stacked intelligent power module package is provided. The intelligent power module package of the present invention includes a power unit including a heat sink and a control unit which is separately manufactured from the power unit and is subsequently stacked on the power unit. The power unit and the control unit of the intelligent power module package are stacked in two different ways including stacking two wire-bonded leadframes of the power unit and the control unit and stacking two separate semiconductor packages of the power unit and the control unit by using locking means formed in each of the semiconductor packages after a trimming/forming process and an electrical property test are finished.

Stacked intelligent power module package

Growing community of inventors

Anyang, South Korea

Seung-Won Lim