Samsung Electro-mechanics Co., Ltd.

Seung Wan Woo

Young Nam Hwang

Kyung Ho Lee

Suk Jin Ham

Yee Na Shin

Po Chul Kim

Hyun Bok Kwon

Ju Wan Nam

Disclosed herein are a printed circuit board having an embedded electronic device and a method of manufacturing the same. According to a preferred embodiment of the present invention, the printed circuit board having an embedded electronic device includes: a core substrate having circuit layers formed on both surfaces thereof; a taper-shaped cavity formed on the core substrate; and an electronic device embedded in the cavity.

Printed circuit board having embedded electronic device and method of manufacturing the same

Disclosed herein are a system of measuring a warpage and a method of measuring a warpage. The system of measuring a warpage of a sample by analyzing an image photographed by the camera using light that is diffused from a light source and reflected on a surface of a sample and is arrived at the camera through a reference grating part, the system includes: an intake part that removes a fume generated from the sample. By this configuration, it is possible to measure the warpage while effectively removing the fume generated from the sample according to the increase in the temperature of the sample at the time of measuring the warpage, thereby improving the accuracy of the warpage measurement.

System of measuring warpage and method of measuring warpage

Disclosed herein is a method for manufacturing a semiconductor package. According to a preferred embodiment of the present invention, a method for manufacturing a semiconductor package includes: preparing a rectangular frame having a plurality of quadrangular holes; attaching a plurality of semiconductor chips and the frame on one surface of a tape; forming a molding part on the tape to cover the semiconductor chip and the frame; peeling the tape; forming a resin layer at a portion at which the tape is peeled; and forming a wiring on the resin layer to be connected to the semiconductor chip.

Method for manufacturing semiconductor package

Disclosed herein is an electronic component package including: a connection member provided on at least one surface of a substrate; an active element coupled to the substrate by the connection member; a molding part covering an exposed surface of the active element; and an additional layer formed on an exposed surface of the molding part to decrease a warpage phenomenon. In the electronic component package, the warpage phenomenon may be decreased as compared with the related art.

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Suwon, South Korea

Seung Wan Woo