Samsung Electronics Co., Ltd.

Samsung Led Co., Ltd.

Seung-tae Choi

Chang-youl Moon

Su-ho Shin

Kyu-ho Shin

Ki-hwan Kwon

Soon-cheol Kweon

Ji-hyuk Lim

Arthur Darbinian

In-sang Song

Sang-Wook Kwon

Woon-bae Kim

Jong-seok Kim

Young-tack Hong

Eun-sung Lee

Jeong-yub Lee

Seung-jin Oh

Eun-seok Park

An LED package includes a substrate having an electrically conductive portion and an electrically non-conductive portion composed of an oxide of the conductive portion; an LED mounted on the conductive portion and electrically connected to the conductive portion; a first electrode disposed on the non-conductive portion and electrically connected to the LED by a wire; and a second electrode disposed on the substrate and electrically connected to the LED.

LED package structure and manufacturing method, and LED array module

An LED package and a fabrication method thereof are provided. The LED package includes an upper metal plate having an LED-receiving hole therein; a lower metal plate disposed under the upper metal plate; and an insulator which the upper metal plate and the lower metal plate from each other. A portion of the lower metal plate is exposed via the LED-receiving hole and an LED is mounted on the exposed portion of the lower metal plate and is electrically connected to both of the upper and lower metal plates. A protective cover encloses and protects exposed surfaces of the upper and lower metal plates.

LED package and fabrication method thereof

A method of fabricating a backlight module in which at least one luminescence element is positioned, including: positioning a luminescence element in at least one cavity formed on a carrier; forming a lower electrode on a substrate; transferring the luminescence element positioned on the carrier to the substrate, connecting the luminescence element to a pattern of the lower electrode formed on the substrate, and removing the carrier; forming an insulating layer on a surface of the substrate to which the luminescence element is transferred, and exposing a top region of the luminescence element; and forming an upper electrode on the exposed top region of the luminescence element. Accordingly, the backlight module including very small luminescence elements being of a micro unit in size is easily fabricated.

Backlight module including at least one luminescence element, and method of fabricating the same

A tunable capacitor using an electrowetting phenomenon includes a first electrode; a second electrode which is spaced apart from the first electrode and faces the first electrode; a fluidic channel which is disposed between the first electrode and the second electrode; a first insulating layer which is disposed between the first electrode and the fluidic channel; and a conductive fluid which is disposed in the fluidic channel and moves along the fluidic channel when a direct current (DC) potential difference occurs between the first and second electrodes. Accordingly, it is possible to fabricate the tunable capacitor with the simplified fabrication process, good reliability and durability, and no restriction on the tuning range.

Tunable capacitor using electrowetting phenomenon

A MEMS structure includes an element substrate, an electrode pad formed on the element substrate, a MEMS activated element formed on the element substrate, and having an electrode-connecting layer, and a connecting line to electrically connect the electrode pad and the electrode-connecting layer.

MEMS structure and method of fabricating the same

Growing community of inventors

Suwon-si, South Korea

Seung-tae Choi