Korea Institute of Fusion Energy

Seung Ryul Yoo

Dong Chan Seok

Yong Ho Jung

Yong Sup Choi

Kang Il Lee

Soo Ouk Jang

Jong Sik Kim

Tai Hyeop Lho

A method for water-repellent coating treatment of a boron nitride powders and water-repellent treated boron nitride are disclosed. The method includes producing a water-repellent coating layer on the surface of the boron nitride powders by plasma treatment using a silicon-containing organic compound containing silicone, wherein the water-repellent coating layer remains on the boron nitride through chemical binding with the boron nitride even after ultrasonic water washing.

Method for water-repellent treatment of boron nitride powder and water-repellent-treated boron nitride

Disclosed is a plasma surface treatment apparatus for conductive powder. The plasma surface treatment apparatus for conductive powder comprises: a reaction chamber including a linear gas inlet at the lower end thereof and a gas outlet at the upper end thereof, and having a vertical cross section that is funnel-shaped; and a plasma jet generation device that is located below the linear gas inlet and is configured to discharge a plasma jet into the reaction chamber from below in an upward direction through the linear gas inlet, wherein powder is accommodated in the reaction chamber and is treated by plasma while buoyed by the plasma jet.

Plasma surface treatment apparatus for conductive powder

A point etching module using an annular surface-discharge plasma apparatus is disclosed. The point etching module using an annular surface-discharge plasma apparatus comprises: a plate-shaped dielectric; a circular electrode disposed on and in contact with the upper surface of the dielectric; an annular electrode disposed on and in contact with the lower surface of the dielectric and providing a gas receiving space for receiving gas; and a power supplier for applying high voltage between the circular electrode and the annular electrode, wherein when the application of the high voltage starts an electric discharge, filament type plasma is irradiated toward a substrate to be treated, by using plasma flowing in the center direction of the annular electrode from between the inner surface of the annular electrode and the lower surface of the dielectric.

Point etching module using annular surface dielectric barrier discharge apparatus and method for control etching profile of point etching module

An atomic layer polishing method is described. The method includes: scanning the surface of a specimen to measure a peak site on the specimen surface; spraying toward the measured peak site a gas containing an element capable of binding to a first atom, which is an ingredient of the material of the specimen to form a first reaction gas layer in which the first reaction gas binds to the first atom on the surface of the peak; and projecting ions of inert gas to the peak site on which the first reaction gas layer is deposited to separate the first atom bound to the first reaction gas from the specimen.

Growing community of inventors

Daejeon, South Korea

Seung Ryul Yoo