Seoul Semiconductor Co., Ltd.

Seung Ryeol Ryu

Seok Jin Kang

Kwang Yong Oh

Myung Jin Kim

Chung Hoon Lee

Do Hyung Kim

Kwang Il Park

Seung Sik Hong

Sang Min Lee

Jae Ho Cho

Tae Kwang Kim

Chan Sung Jeong

Sang Geun Bae

Kwang Ii Park

Woong Joon Hwang

A light emitting diode package including a housing, first and second light emitting diode chips disposed in the housing, and a wavelength conversion part including a phosphor to absorb light emitted from the first light emitting diode chip and emit light having a different wavelength than that emitted from the first light emitting diode chip, in which light emitted from the first light emitting diode chip has a shorter wavelength than light emitted from the second light emitting diode chip, the wavelength conversion part is configured to emit red light having a peak wavelength of 580 nm to 700 nm and exhibiting at least three peaks at a wavelength of 600 nm to 660 nm, and the light emitting diode package is configured to emit white light by mixing light emitted from the first light emitting diode chip, the second light emitting diode chip, and the wavelength conversion part.

Light emitting diode package and light emitting diode module

A light emitting diode package including a housing, a first light emitting diode chip and a second light emitting diode chip disposed in the housing, and a wavelength conversion part including a phosphor configured to absorb light emitted from the first light emitting diode chip and emit light having a different wavelength than the light emitted from the first light emitting diode chip, in which the light emitted from the first light emitting diode chip has a shorter wavelength than light emitted from the second light emitting diode chip, and the phosphor has a fluorescence intensity of 10 or less at a peak wavelength of light emitted from the second light emitting diode chip, with reference to a maximum fluorescence intensity of 100 at a wavelength of 425 nm to 475 nm on an excitation spectrum of the second light emitting diode chip.

Disclosed is a light emitting diode (LED) package. The LED package comprises a package body having a cavity and a stepped portion positioned on a top portion of the cavity; an LED chip mounted on a bottom surface of the cavity; an encapsulant formed in the cavity to cover the LED chip; and a lens having a pattern and attached to the stepped portion on the encapsulant.

LED package and back light unit using the same

The present invention relates to a luminous element, and more particularly, to a luminous element for a backlight unit with a plurality of luminous chips mounted on a substrate. The present invention provides a luminous element for a backlight unit, in which luminous chips are arranged on a substrate so that the manufacturing process and cost can be reduced and the size of a substrate is minimized when manufacturing the luminous element, thereby minimizing the size of a backlight unit. Further, the present invention provides a luminous element for a backlight unit, in which luminance uniformity can be increased by optimizing the viewing angle of the luminous element.

Luminous element for backlight unit

A light emitting diode (LED) lighting apparatus that may be used as interior lighting or advertisement lighting is disclosed. The LED lighting apparatus includes a channel-type or tube-type optical housing with a light emission surface and an LED array arranged in the optical housing. The light emission surface includes a valley line and a first inner ridge and a second inner ridge disposed on opposing sides of the valley line, and the LED array includes a plurality of LEDs whose centers are arranged along the valley line.

Tube-type or channel-type LED lighting apparatus

Disclosed is a backlight panel employing a white light emitting diode. The white light emitting diode includes a blue light emitting diode chip and red and green phosphors positioned over the blue light emitting diode chip. Accordingly, since the backlighting can be performed using white light with distinct red, green and blue wavelengths, the color reproducibility can be enhanced. Further, since the white light can be implemented with a single light emitting diode, the manufacturing costs and thickness of the backlight panel can also be reduced.

Backlight panel employing white light emitting diode having red phosphor and green phosphor

A light guide device is used in a back light module that more uniformly mixes different colored light emitted from a plurality of LEDs and transfers the mixed light to a display panel, wherein a light loss can be minimized during the light mixing process and the light can be more uniformly mixed. A light guide device is disclosed for mixing different colored light emitted from a plurality of light emitting diodes (LEDs) and guiding the mixed light to a display panel, wherein the light guide device comprises a light guide portion in the form of a plate arranged at a rear of the display panel; and a light mixing portion formed integrally with the light guide portion and including a light incidence surface adjacent to the plurality of LEDs and a light mixing area for mixing the light with difference colors incident through the light incidence surface.

Growing community of inventors

Ansan-si, South Korea

Seung Ryeol Ryu