Samsung Electronics Co., Ltd.

Seung-Moon Yoo

Ejaz Ul Haq

Soo-In Cho

Nam-Soo Kang

Dae-je Chin

Seung-Hun Lee

Yun-Ho Choi

Bok-Moon Kang

Kyu-Chan Lee

Jung-Hwa Lee

Dong-Il Seo

Hong-sun Hwang

Jei-Hwon Yoo

An internal power control circuit for a semiconductor device allows easy testing of the internal circuit blocks or memory arrays at various voltage levels. In the semiconductor device, internal voltage switching circuits connected between the internal power supply line and each array power supply line are switched ON or OFF according to signals applied to control pads coupled to each internal voltage switching circuit. During normal operation, a power voltage generated by the internal voltage generator is applied through an internal power supply line to each array power supply line coupled to the internal circuit blocks. During a test operation, different power voltages may be applied to the control pads to selectively decouple individual array power supply lines from the internal power supply line, and selectively couple the power voltages applied to the control pads to the corresponding array power supply lines and internal circuit blocks.

Internal power control circuit for a semiconductor device

A semiconductor memory device stably operates over a wide range of the power supply voltage by including a power supply voltage level detector for generating detecting signals according to predetermined levels of the power supply voltage and an oscillator for generating a frequency-controlled oscillation pulse whose frequency is changeable according to the detecting signals. Thus, a boosting ratio of a boosting circuit, the refresh period of a refresh circuit and the substrate voltage of a substrate voltage generator can be adaptively changeable according to the variation of the power supply voltage.

Semiconductor memory device

A semiconductor memory device such as a DRAM has an internal oscillator to provide a periodic clock signal. During a read operation, output data is generated synchronized to the internal clock signal, and an external control signal is provided also synchronized to the internal clock signal. A requesting device utilizes the external control signal for fetching data from the memory device at high speed with improved setup and hold time. The control signal output is active only during a read operation, thereby reducing power consumption. Additionally, a common line is used for receiving address, instructions, and data. This drastically reduces the number of pins for interfacing to a memory device.

Semiconductor memory device using asynchronous signal

An integrated circuit memory device includes a main row decoder, a sub-row decoder, and a sub-word line driver. The main row decoder decodes the first portion of a row address, and generates a main row activation signal when one of the plurality of rows have been selected. The sub-row decoder decodes a second portion of the row address, and generates a first sub-row activation signal when a first one of the plurality of rows has been selected. The sub-row decoder generates a second sub-row activation signal when a second one of the plurality of rows has been selected. The sub-word line driver activates a first memory cell in the first row in response to the main row activation signal and the first sub-row activation signal. The sub-word line driver activates a second memory cell of the second row in response to the main row activation signal and the second sub-row activation signal. The sub-word line driver includes a first driver circuit which activates the first memory cell in response to the main row activation signal, the first sub-row activation signal, and an inverse of the first sub-row activation signal. The sub-word line driver also includes a second driver circuit which activates a second memory cell in response to the main row activation signal, the second sub-row activation signal, and an inverse of the second sub-row activation signal.

Integrated circuit memory devices including sub-word line drivers and

An internal power supply circuit for a semiconductor memory device comprising a differential amplifier having a reference voltage as an input and utilizing an external power supply voltage. An amplifier output provides an internal power supply voltage. The amplifier is connected to a current source which comprises a plurality of transistors connected in series between one side of said amplifier and ground. A current control transistor having a channel larger than the channels of the transistors connected in series is switchable between a first state in which the current control transistor is substantially on and a second state in which said current control transistor is substantially off.

Source voltage generating circuit in semiconductor memory

A substrate bias voltage controlling circuit controls the generation of different substrate bias voltages according to specific modes. A first sensing signal generator is controlled by the substrate bias voltage and generates a first sensing signal when the level of the substrate bias voltage is higher than a predetermined first potential level. A second sensing signal generator is controlled by the substrate bias voltage and a specific mode signal and generates a second sensing signal when the level of the substrate bias voltage is higher than a predetermined second potential level and when the mode signal is enabled.

Substrate bias voltage controlling circuit in semiconductor memory device

A voltage detection unit between a data output buffer terminal and the gate a transistor which is used to dissipate a high level voltage on the internal data line. The detection unit thus prevents an undesired electrical path from existing in the data output buffer circuit. In one embodiment, the detection unit consists of an NMOS and PMOS transistor connected in series and having a shared node connected to the voltage dissipating transistor. In another embodiment, there is also connected an invertor between the shared node and the gates of the NMOS and PMOS transistors.

Data output buffer circuit of semiconductor memory device

Disclosed is a DC voltage generating circuit for reducing an electric power consumption in a semiconductor memory device. The DC voltage generating circuit comprises: a refresh counter for setting a refresh cycle; a power source supply controller for logically combining a counting value supplied from the refresh counter and a self-refresh timer driving signal, thereby to generate a power source supply control signal in a refresh section; and a DC voltage generator for generating and supplying a DC voltage through an output terminal of the DC voltage generator, as controlled by the power source supply control signal supplied from the power source supply controller.

Direct-current voltage generating circuit intermittently activated for

The present invention relates to a semiconductor memory device and more particularly to a semiconductor memory device capable of executing a self-refresh operation to achieve a low power consumption, and of executing a burn-in operation in wafer and package states as well. A semiconductor memory device comprising a plurality of memory cells arranged in rows and columns, a word line being arranged in each row to select the rows of the plurality of memory cells in response to an input of row address, a bit line being arranged in each column to select the columns of the plurality of memory cells in response to an input of column address, and the row address for designating a row accessed in a previous selection operation upon selection of an arbitrary word line comprising a controller for executing the arbitrary word line selection.

Semiconductor memory device having low power self refresh and burn-in

Clock pads are distributed over an integrated circuit memory device and electrically connected to a lead frame to synchronously provide an external clock signal to the clock pads. Accordingly, an internal clock signal is generated throughout the integrated circuit memory device by distributing an external clock signal using a lead frame and pads. Internal circuitry for generating and synchronizing an internal clock from an external clock is thereby not required. When the integrated circuit memory device includes multiple memory array banks, the clock pads may be located in a row of input/output pads adjacent a memory array bank or between pairs of memory array banks.

Lead frame clock distribution for integrated circuit memory devices

A memory module having parity and capable of performing a read-modify-write (RMW) operation is provided. The memory module has data input and output pins for processing a plurality of data bits and a parity bit and is comprised of one semiconductor memory device which processes the parity bit and a plurality of semiconductor memory devices which each process a plurality of data bits. All of the memory devices include at least one data input/output pin for receiving and supplying data and at least one control pin for receiving a control signal. The memory module according to the present invention is simply constructed so as to yield high integration in a semiconductor integrated circuit, and is capable of high-speed applications.

Memory module having read-modify-write function

A half power supply voltage generating circuit receiving first and second power supply voltages and comprising; a bias circuit for generating first and second reference voltages in response to the first and second power supply voltages, and a driver circuit receiving the first and second reference voltages and generating a half power supply voltage, the driver circuit comprising four MOS transistors connected in series between the first and second supply voltages.

Growing community of inventors

Suwon, South Korea

Seung-Moon Yoo