Iobed Inc.

Amkor Technology, Inc.

Amkor Technology Singapore Holding Pte. Ltd.

Cj Logistics Corporation

Berex Tech Co., Ltd

Seung Mo Kim

Dong Wook Shin

Young Jun Yu

Keon Yong Lee

Dong Hun Lee

Gi Jeong Kim

Byong Jin Kim

Marc Alan Mangrum

Jae Min Bae

Young Ju Lee

Hyung Jun Cho

Jin An Lee

Tae Young Chung

Se Man Oh

Chang Hun Kim

Koo Po Kwon

Jae Sook Jung

Lucian M Hand

Christopher J De Simone

Jung Hwa Kim

A method for forming packaged electronic device structure includes providing a conductive leadframe. The leadframe can include a die pad and a plurality of conductive leads. The method can include coupling an electronic device to the plurality of conductive leads. The method can include providing an antenna structure, which can include a conductive pillar structure and an elongated conductive beam structure. The method can include providing a package body encapsulating the electronic device, at least portions of each conductive lead, and at least portions of the die pad. In an example, the conductive pillar structure can extend from the first package body surface to the second package body surface, the elongated conductive beam structure can be disposed adjoining the first package body surface and can be electrically connected to the conductive pillar structure, and a portion of the elongated conductive beam structure can be exposed outside of the package body.

Packaged electronic device having integrated antenna and locking structure

A method for forming packaged electronic device structure includes providing a conductive leadframe. The leadframe can include a die pad with a first major surface and a second major surface opposite to the first major surface, and a plurality of conductive leads. The method can include coupling an electronic device to the plurality of conductive leads. The method can include providing an antenna structure, which can include a conductive pillar structure and an elongated conductive beam structure. The method can include providing a package body encapsulating the electronic device, at least portions of each conductive lead, and at least portions of the die pad. In an example, the conductive pillar structure can extend from the first package body surface to the second package body surface, the elongated conductive beam structure can be disposed adjoining the first package body surface and is electrically connected to the conductive pillar structure, and at least a portion of the elongated conductive beam structure is exposed outside of the package body.

The present invention relates to a method of operating a smart mattress system for preventing snoring which can stop snoring of a user, wherein an air mattress and an air pillow interlock with a user terminal so that a user can easily control the air mattress and the air pillow.

Method for operating snoring-preventing smart mattress system

The present invention relates to a smart mattress system for preventing snoring of a user, wherein a sleep posture of the user is determined and pressure of an air mattress and pressure of an air pillow are adjusted depending on the sleep posture of the user, whereby snoring of the user is stopped.

Snoring-preventing smart mattress system

The present invention relates to a method of operating a smart mattress system enabling alarm control, wherein a user is allowed to transition to a light sleep state before an alarm time set by the user. Furthermore, an air mattress and an air pillow interlock with a user terminal so that the user can easily control the air mattress and the air pillow.

Method for operating smart mattress system enabling alarm control

Disclosed are a logistics movement automation system and method in which transfer means automation and moving path optimization have been implemented in association with the existing logistics automation system for integrated cargo warehousing and delivery. When unit cargoes are piled up from an association system outside or within a warehouse to an association transfer unit, a recognition unit generates recognition information by recognizing the unit cargoes and transfers the recognition information to a control unit. The control unit generates a moving path based on the received recognition information using an optimization algorithm and moves, arranges, distributes or flat keeps the unit cargoes along the generated moving path through at least one of the association transfer unit, the distribution transfer unit and the plate unit for warehousing or delivery.

Logistics movement automation system and method

An air mattress includes an air pocket unit including an air pocket module, a body portion into which the air pocket unit is inserted and fixed, a controller mounted at the body portion and controlling the air pocket unit, and a pressure sensor unit measuring pressure of the air pocket unit. The air pocket module includes multiple air pockets each having a hollow portion formed therein and configured to inflate due to air inflow or to deflate due to air outflow, and a bottom plate coupled to lower sides of the air pockets and configured to block the hollow portion of each of the air pockets.

Air pocket module and air mattress including same

An air mattress system includes an air mattress configured to self-adjust its own pressure, a user terminal receiving a set value or user information from a user and transmitting the set value or the user information to the air mattress, and a server receiving measurement data from the air mattress to analyze a sleep pattern and sleep quality of a user and transmitting the analyzed sleep pattern and sleep quality to the user terminal, wherein the air mattress is configured such that the air mattress is divided into multiple sections and the pressure is adjusted for each section based on the set value or the user information.

Air mattress system and controlling method of air mattress system

An air pocket module inserted into an air mattress includes multiple air pockets each having a hollow portion formed therein and configured to inflate due to air inflow or to deflate due to air outflow, and a bottom plate coupled to lower sides of the air pockets and configured to block the hollow portion of each of the air pockets, wherein the air pocket includes: a top surface portion forming a top surface, a side surface portion connected with the top surface portion and forming a side surface, and a contact portion protruding upwardly from a center of the top surface portion.

A fingerprint sensor device and a method of making a fingerprint sensor device. As non-limiting examples, various aspects of this disclosure provide various fingerprint sensor devices, and methods of manufacturing thereof, that comprise a substrate comprising a dielectric layer and a wiring pattern embedded in and exposed from the dielectric layer.

Finger print sensor and manufacturing method thereof

A packaged electronic device includes an integrated antenna as part of a conductive leadframe. The conductive leadframe includes a die paddle have an elongated conductive beam structure configured as a transmission line, and a ground plane structure disposed surrounding the die paddle. The ground plane includes a gap where the transmission line extends to an edge of the packaged electronic device. In one embodiment, selected leads within the leadframe are configured with conductive connective structures as ground pins, source pins, and/or wave guides. In an alternate embodiment, a portion of the integrated antenna is embedded and partially exposed within the body of the packaged electronic device.

A semiconductor package having a fully encapsulated heat sink is disclosed, along with leadframes for making the package. A semiconductor chip is mounted on a surface of the heat sink. The heat sink is in an electrically insulative, thermally conductive connection with a plurality of leads that extend from a first end that overhangs the heat sink to an second end outside of the package body. A ring of a double sided adhesive tape attaches the heat sink to the overhanging portion of the leads. The heat sink design minimizes voids and damage caused by the encapsulation process, while maintaining thermal performance comparable to conventional, exposed heat sinks.

Nonexposed heat sink for semiconductor package

A leadframe and molded semiconductor package made using the leadframe are disclosed. The leadframe includes leads extending from a dam bar toward a central chip mounting region. A pseudo tie bar extends diagonally from three of the four corners of the dam bar toward the chip mounting region. A resin introduction slot is at the remaining corner of the dam bar. The resin introduction slot is wider than a space between adjacent leads. The leads adjacent to the resin introduction slot increase in width as they extend from the dam bar toward the chip mounting region. The leadframe is used to form a semiconductor package having a package body formed of a molded resin. The leadframe design minimizes voids and damage caused by the molding process.

Growing community of inventors

Seoul, South Korea

Seung Mo Kim