Samsung Electronics Co., Ltd.

Other

Sungkyunkwan University

Semes Co., Ltd.

Qubit Security Inc.

Seung Min Shin

Kun Tack Lee

Seok Hoon Kim

Yong Jun Choi

Ji Hoon Cha

Hun Jae Jang

In Gi Kim

Jinwoo Lee

Young-Hoo Kim

Tae-Hong Kim

Sung Hyun Park

Seongkeun Cho

Eun Hee Jeang

Tae Min Earmme

Young Hoo Kim

Jin Woo Lee

Young Chan Kim

In Gun Kim

Byoung Kuk Lee

Ji Hwan Park

Pil Kyun Heo

Sun Jin Kim

Han Sol Seo

Seo Hyun Kim

Sang Jin Park

Joon Ho Won

Hyun Cheol Jin

Jin Yeong Sung

Joon Young Jeon

Hae Won Choi

Jang Jin Lee

Koriakin Anton

Seung Ho Kim

Hyun Woo Nho

An apparatus is provided. The apparatus includes a spinner configured to hold a wafer, a nozzle configured to supply a liquid chemical onto an upper surface of the wafer, and a laser module configured to heat the wafer by radiating a laser beam to a lower surface of the wafer while the nozzle supplies the liquid chemical onto the upper surface of the wafer.

Method of manufacturing semiconductor device using stationary laser module

A wafer cleaning method is provided. The wafer cleaning method includes providing a wafer on a stage that is inside of a chamber. The wafer is fixed to the stage by moving a grip pin connected to an edge of the stage. First ultrapure water is supplied onto the wafer while the wafer is rotating at a first rotation speed. The grip pin is released from the wafer by moving the grip pin. A development process is performed by supplying liquid chemical onto the wafer while the wafer is rotating at a second rotation speed that is less than the first rotation speed.

Wafer cleaning apparatus and wafer cleaning method using the same

A wet etching apparatus includes a process bath having an internal space configured to receive an etchant and having a support unit, on which a wafer is disposed to be in contact with the etchant. A laser unit is disposed above the process bath and is configured to direct a laser beam to the wafer and to heat the wafer thereby. An etchant supply unit is configured to supply the etchant to the internal space of the process bath.

Wet etching apparatus

A wafer cleaning apparatus is provided. The wafer cleaning apparatus includes comprising a chamber configured to be loaded with a wafer, a nozzle on the wafer and configured to provide liquid chemicals on an upper surface of the wafer, a housing under the wafer, a laser module configured to irradiate laser on the wafer, a transparent window disposed between the wafer and the laser module, and a controller configured to control on/off of the laser module, wherein the controller is configured to control repetition of turning the laser module on and off, and retain temperature of the wafer within a temperature range, and a ratio of time when the laser module is on in one cycle including on/off of the laser module is 30% to 50%.

An apparatus and method for treating a substrate are provided. The apparatus includes at least one first process chamber configured to supply a developer onto the substrate; at least one second process chamber configured to treat the substrate using a supercritical fluid; a transfer chamber configured to transfer the substrate from the at least one first process chamber to the at least one second process chamber, while the developer supplied in the at least one first process chamber remains on the substrate; and a temperature and humidity control system configured to manage temperature and humidity of the transfer chamber by supplying a first gas of constant temperature and humidity into the transfer chamber.

Apparatus and method for treating substrate including process chambers and transfer chamber

A wafer cleaning apparatus, a method of cleaning wafer and a method of fabricating a semiconductor device are provided. The method of fabricating the semiconductor device includes disposing a wafer on a rotatable chuck, irradiating a lower surface of the wafer with a laser to heat the wafer, and supplying a chemical to an upper surface of the wafer to clean the wafer, wherein the laser penetrates an optical system including an aspheric lens array, the laser penetrates a calibration window, which includes a first window structure including a first light projection window including first and second regions different from each other, a first coating layer covering the first region of the first light projection window, and a second coating layer covering the second region of the first light projection window, and the first coating layer and the second coating layer have different light transmissivities from each other.

Wafer cleaning apparatus, method for cleaning wafer and method for fabricating semiconductor device

A multi-chamber apparatus for processing a wafer, the apparatus including a high etch rate chamber to receive the wafer and to etch silicon nitride with a phosphoric acid solution; a rinse chamber to receive the wafer and to clean the wafer with an ammonia mixed solution; and a supercritical drying chamber to dry the wafer with a supercritical fluid.

Multi-chamber apparatus

Semiconductor device manufacturing apparatus including laser module

A wafer cleaning equipment includes a housing to be positioned adjacent to a wafer, a hollow region in the housing, a laser module that outputs a laser beam having a profile of the laser beam includes a first region having a first intensity and a second region having a second intensity greater than the first intensity, the laser beam being output into the hollow region, and a transparent window that covers an upper part of the hollow region and transmits the laser beam to be incident on an entirety of a lower surface of the wafer.

Wafer cleaning equipment

A web traffic logging system includes: a log setting unit which performs setting for collecting log from at least one of a web server and a web server operating system; a log gathering unit which creates log information including the log collected in accordance with the setting; and a log transmitting unit which transmits the log information to a cloud server.

Web traffic logging system and method for detecting web hacking in real time

The present disclosure provides a protective case for a mobile terminal, the protective case including: a mobile terminal case which has a box shape, and surrounds and protects a mobile terminal; an auxiliary battery case which is positioned outside a rear surface of the mobile terminal case, and defines a space for accommodating an auxiliary battery; a mobile terminal side contact terminal which is disposed on an inner surface of the mobile terminal case, and is in electrical contact with an external terminal of the mobile terminal; and an auxiliary battery side contact terminal which is disposed on an inner surface of the auxiliary battery case, and is in electrical contact with an external terminal of the auxiliary battery, in which electric power of the auxiliary battery is provided to the mobile terminal through a connecting cable that electrically connects the mobile terminal side contact terminal and the auxiliary battery side contact terminal.

Protective case for a mobile terminal

A direct current (DC) power supply apparatus includes an input unit configured to receive an outside DC power; a plurality of polarity correction units configured to correct the polarity of the outside DC power; a plurality of switch units installed to correspond to each of the plurality of polarity correction units; a detection unit configured to detect a flow of current of the plurality of polarity correction unit; and a control unit configured to determine a polarity correction unit, at which current of DC power flows, among the plurality of correction units based on a detection signal of transmitted from the detection unit, and control the switch unit corresponding to the determined polarity correction unit at an ON position such that the current of DC power flows through the switch unit which is controlled at the ON position.

DC power supply apparatus configured to correct input polarity of DC power

Growing community of inventors

Suwon-si, South Korea

Seung Min Shin