Samsung Electronics Co., Ltd.

Adeka Corporation

Dnf Co., Ltd.

Seung-min Ryu

Yeon-kyoung Jung

Youn-Joung Cho

Jong-in Lee

Su-aa Jung

Kyung-Hoon Lee

Jae-Soon Lim

Youn-soo Kim

Gyu-Hee Park

Cheol Ham

Takanori Koide

Naoki Yamada

Jae-hwan Kim

Hyung-suk Jung

Seong-jin Kim

Younjoung Cho

Kyu-Ho Cho

Tsubasa Shiratori

Jaesoon Lim

Kyung-hoon Lee

Chang-su Woo

Hee-jung Roh

Seung-Soon Jang

Soyoung Lee

Hee-Won Jung

Akio Saito

Dae Hee Lee

Younsoo Kim

Jong In Lee

Atsushi Yamashita

Jong-moon Eun

Heung-sup Park

Kang-yong Lee

Myong-Woon Kim

Sang-Ick Lee

Kazuki Harano

Sang-Chul Youn

Jae-Yoon Jung

Jun-hoe Cha

Soon-Nam Kim

Sang-yong Jeon

Taek-yong Jung

Moon-Soo Park

Yeon-Kyoung Jung

Soon-Gil Hong

An integrated circuit device includes a lower electrode, an upper electrode, and a dielectric layer structure between the lower electrode and the upper electrode, the dielectric layer structure including a first surface facing the lower electrode and a second surface facing the upper electrode. The dielectric layer structure includes a first dielectric layer including a first dielectric material and a plurality of grains extending from the first surface to the second surface and a second dielectric layer including a second dielectric material and surrounding a portion of a sidewall of each of the plurality of grains of the first dielectric layer in a level lower than the second surface. The second dielectric material includes a material having bandgap energy which is higher than bandgap energy of the first dielectric material.

Integrated circuit device

Described herein are metal compounds and methods of fabricating semiconductor devices using the same. The metal compounds include a material of Chemical Formula 1. 

Metal compounds and methods of fabricating semiconductor devices using the same

A method of manufacturing a semiconductor device, the method including providing a metal precursor on a substrate to form a preliminary layer that includes a first metal; providing a reducing agent on the preliminary layer, the reducing agent including a compound that includes a second metal; and providing a reactant on the preliminary layer to form a metal-containing layer, wherein the second metal has multiple oxidation states, the second metal in the reducing agent having a lower oxidation state among the multiple oxidation states prior to providing the reducing agent on the preliminary layer.

Method of manufacturing semiconductor device

A tin compound, tin precursor compound for atomic layer deposition (ALD), a method of forming a tin-containing material film, and a method of synthesizing a tin compound, the tin compound being represented by Chemical Formula (I): 

Method of forming tin-containing material film and method of synthesizing a tin compound

A tantalum compound, a method of forming a thin film, and a method of fabricating an integrated circuit device, the tantalum compound being represented by the following General Formula (I): 

Tantalum compound

Tantalum compound and methods of forming thin film and fabricating integrated circuit device by using the same

A method of manufacturing a semiconductor device is provided. A substrate including a structure in which a hole is formed is prepared. Precursors including a nickel alkoxide compound are vaporized. A nickel-containing layer is formed in the hole by providing the vaporized precursors including the nickel alkoxide compound onto the substrate.

Method of manufacturing semiconductor device including nickel-containing film

A liquid composition to clean an inkjet nozzle, and a inkjet head cleaning unit that contains the same. The liquid composition includes an inkjet ink stabilizer capable of removing impurities from an inkjet nozzle.

Liquid composition to clean nozzle surface and cleaning device having the same

An ink set includes an ink composition including an encapsulated black pigment in which a black pigment is coated with a polymer resin.

Ink set, ink cartridge including the same, and inkjet recording apparatus employing the same

A polymeric dispersant having an affinity with a supercritical fluid is provided, in which a substituent having an affinity with a supercritical fluid is attached to the terminal end of a block copolymer. The polymeric dispersant can disperse a dispersoid to particulate size by lowering surface tension between the dispersoid and the supercritical fluid to promote diffusion of the supercritical fluid into the dispersoid.

Polymeric dispersant having an affinity with a supercritical fluid

A multi-color inkjet ink set includes a first ink composition including a first colorant and a heterocyclic amine compound, and a second ink composition include a second colorant having an, in which the acid moiety of the second colorant within the second ink composition reacts with the heterocyclic amine compound within the first ink composition to form a precipitate to prevent the second colorant from moving on a printing medium.

Multi-color inkjet ink set to prevent color bleeding

A self-dispersible bipyridine-based metal complex includes a bipyridine-based ligand and a metal, and an ink composition including the metal complex. The bipyridine-based metal complex may be self-dispersed without requiring a dispersing agent and may be used as a colorant per se. Furthermore, the metal complex, when binding with a common colorant, may produce various colors and exhibit enhanced durability including light resistance. In addition, the metal complex includes a hydrophilic group-containing ligand coordinating with the metal, in addition to the bipyridine-based ligand, and thus, has a bulky structure. Therefore, dispersion stability is enhanced by a self-dispersion system based on a steric hindrance due to the bulky structure of the metal complex and an electrostatic repulsive force between the charged metal and the hydrophilic group-containing ligand, thus enhancing a long-term storage stability.

Self-dispersible bipyridine-based metal complex and ink composition comprising the same

An ink composition includes a self-dispersible coloring agent that includes an ionic group and a non-ionic linear or cyclic ester or amide moiety on a surface of the coloring agent at a mole ratio of about 1:10 to about 10:1, an organic solvent, and water. The coloring agent has a modified surface, so that stability of the ink can be increased due to an interaction between the coloring agent and the organic solvent, the particle size of the coloring agent can be kept uniform, an adhering force with respect to a substrate is increased to minimize bleeding between colors of a printed image, waterfastness and rubfastness in dry and wet conditions are increased to obtain an excellent colorfastness, and resulting in a high quality printed image and an excellent storage stability.

Ink composition including surface modified coloring agent

A self-dispersible metal complex colorant is represented by formula 1, which has improved storage stability, may embody various colors and has improved fastness, such as light resistance, water resistance and the like: wherein each of Aand Ais independently a moiety which includes a substituted or unsubstituted C-Calkenylene group having at least one double bond and is conjugated with an azo group; each of Xand Xis selected from the group consisting of a hydroxy group, a C-Calkoxy group, a carboxyl group, and a substituted or unsubstituted amino group; M is a polyvalent transition metal; L is a neutral or anionic ligand; T is a mono- or poly-substituted hydrophilic functional group; n is an integer between 1 and 3; and J is a linker. The self-dispersible metal complex colorant may be used in various fields employing colors, such as fibers, foods, drugs, cosmetics, coatings, inks or ceramics.

Self-dispersible metal complex colorant comprising azo moiety

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Seung-min Ryu