Samsung Electro-mechanics Co., Ltd.

Seung Joo Shin

Jong Woon Kim

Jung Won Lee

Hwa Sun Lee

Won Kyu Jeung

Pil Joong Kang

Tae Kyung Lee

Sung Woo Han

Yun Sung Kang

Kwang Su Kim

Jong Hyeong Song

Jeong Il Lee

Ran Hee Shin

Nam Jung Lee

Ji Hye Nam

Won Jae Han

Jin Uk Lee

Jang Ho Park

Sung Sun Kim

Jeong Suong Yang

Byung Hun Kim

Yoon Sok Park

Hyun Kee Lee

Nam Keun Oh

The present disclosure relates to an electronic element package and a method of manufacturing the same. The electronic element package includes a substrate, an element disposed on the substrate, a cap enclosing the element, a bonding portion bonding the substrate to the cap, and blocking portions disposed on both sides of the bonding portion.

Electronic element package and method for manufacturing the same

A bulk acoustic wave resonator includes a substrate, a first electrode and a second electrode disposed on the substrate, and a piezoelectric layer disposed between the first electrode and the second electrode. At least one of the first electrode and the second electrode includes an alloy of molybdenum and tantalum.

Bulk acoustic wave resonator and filter including the same

An acoustic wave resonator includes: a first piezoelectric portion of a piezoelectric layer, disposed on a cavity and having a first average thickness; and a second piezoelectric portion of the piezoelectric layer, disposed adjacent to an edge of the first piezoelectric portion and having a second average thickness that is different from the first average thickness.

Acoustic wave resonator and filter including the same

The present disclosure relates to an electronic element package and a method of manufacturing the same. The electronic element package includes a substrate, an element disposed on the substrate, and a cap enclosing the element. One of the substrate and the cap includes a groove, the other of the substrate and the cap includes a protrusion engaging with the groove. A first metal layer and a second metal layer form a metallic bond with each other in a space between the groove and the protrusion.

Bulk acoustic wave resonator with a molybdenum tantalum alloy electrode and filter including the same

Disclosed herein is an angular velocity sensor. The angular velocity sensor according to an embodiment of the present invention is configured to include a mass body, a first frame disposed at an outer side of the mass body so as to be spaced apart from the mass body, a first flexible part connecting the mass body to the first frame in an X-axis direction, a second flexible part connecting the mass body with the first frame in a Y-axis direction, a second frame disposed at an outer side of the first frame so as to be spaced apart from the first frame, a third flexible part connecting the first frame with the second frame in an X-axis direction, and a fourth flexible part connecting the first frame with the second frame in a Y-axis direction.

Angular velocity sensor with flexible parts providing different rigidities

An angular velocity sensor comprises a mass body part including a first mass body and a second mass body, an internal frame supporting the first mass body and the second mass body, one or more first flexible parts connecting the first mass body or the second mass body to the internal frame, one or more second flexible parts connecting the first mass body or the second mass body to the internal frame, an external frame supporting the internal frame, at least one third flexible part connecting the internal frame to the external frame, and at least one fourth flexible part connecting the internal frame to the external frame. At least one of the second flexible parts is connected to the first mass body in line with the center of gravity of the first mass body. At least one other of the second flexible parts is connected to an eccentric portion of the second mass body.

Sensing module and angular velocity sensor having the same

Disclosed herein is an acceleration sensor, including: a mass body part including a first mass body and a second mass body; a frame supporting the first mass body and the second mass body; first flexible parts each connecting the first mass body and the second mass body to the frame; and second flexible parts each connecting the first mass body and the second mass body to the frame, wherein the first mass body and the second mass body are each connected to the frame so as to be eccentric by the second flexible part.

Acceleration sensor and angular velocity sensor

There is provided a touch sensor including: a base substrate; a first electrode pattern formed on the base substrate and including first electrode lines repeatedly arranged in parallel with each other; and a second electrode pattern formed on a surface spaced apart from a surface on which the first electrode pattern is formed and including second electrode lines intersecting with the first electrode lines and repeatedly arranged in parallel with each other, wherein an extension line connecting intersection points between the first and second electrode lines to each other is formed as an oblique line with respect to a horizontal direction.

Touch sensor

There is provided an inkjet print head including: an ink discharging unit including a plurality of actuators; a connection substrate disposed on the ink discharging unit and having a first circuit pattern electrically connected to the plurality of actuators; and a switching board having a second circuit pattern connected to the first circuit pattern and including a plurality of driving integrated chips (ICs) controlling the plurality of actuators.

Inkjet print head

Angular velocity sensor

There is provided a monitoring apparatus for an inkjet head including a resistance element connected between a driving circuit generating a driving signal and a piezoelectric element applying pressure to an ink chamber according to the driving signal, an amplifier unit amplifying a differential voltage between an output voltage from the driving circuit and a voltage generated in the piezoelectric element, and a detecting unit detecting whether ink is being normally ejected, based on the amplified differential voltage from the amplifier unit.

Growing community of inventors

Suwon-si, South Korea

Seung Joo Shin