Cheil Industries Inc.

Samsung Sdi Co., Inc.

Seung Jib Choi

Kyoung Jin Ha

Ji Hye Kwon

Chang Min Lee

Yeon Soo Lee

Seong Ryong Nam

Ji Yeon Lee

Se Il Oh

Irina Nam

Chang Soo Woo

Sung Min Ko

Mi Sun Kim

Lee June Kim

Jin Seong Park

Chang Beom Chung

Gyu Seok Song

Jin Ah Lee

Kyung Ju Lee

Jun Suk Kim

Hwan Sung Chun

Seung Woo Chang

Min Haeng Cho

Eui Soo Jeong

Myoung Youp Shin

Hye Won Seo

Chae Won Pak

In Jae Song

Taek Jin Baek

Hyo Young Kwon

The present invention relates to a photocured composition comprising (A) a photocurable monomer and (B) a monomer of chemical formula 1, a blocking layer comprising the same, and an encapsulated device comprising the same.

Photocured composition, blocking layer comprising same and encapsulated device comprising same

A photocurable composition includes (A) a photocurable monomer and (B) a silicon-containing monomer or oligomer thereof, the silicon-containing monomer being represented by Formula 1 

Apparatus comprising an encapsulated member

The present invention relates to: a photocurable composition containing (A) a photocurable monomer and (B) a monomer containing phosphorus and an amide group; and a device including a barrier layer formed of the composition.

Photocurable composition and device including barrier layer formed from composition

The present invention relates to a photocurable composition including (A) a photocurable monomer, (B) a monomer of chemical formula 1 or an oligomer thereof and (C) an initiator, a barrier layer including the same and an enveloped device including the same.

Photocurable composition and enveloped device including same

A composition for encapsulation and an encapsulated apparatus, the composition including a (meth)acrylic alkoxysilane monomer including a moiety represented by Formula 1 or 2, below, or an oligomer thereof; a multifunctional (meth)acrylate monomer or an oligomer thereof; and an initiator, wherein * and ** represent a binding site between elements.

Composition for encapsulation and encapsulated apparatus including the same

The present invention relates to a thermosetting composition for an organic light-emitting element filler, which comprises (A) 100 parts by weight of an epoxy-based resin including (A1) an epoxy resin having a weight average molecular weight of around about 200 g/mol or more to less than about 1000 g/mol, (A2) an epoxy resin having a weight average molecular weight of around about 1000 g/mol or more to less than about 20000 g/mol and (A3) an epoxy resin having a weight average molecular weight of about 20000 g/mol or more to less than about 100000 g/mol, (B) about 10 parts by weight to about 40 parts by weight of a sheet-like filler and (C) about 0.1 parts by weight to about 20 parts by weight of an imidazole curing agent having a cyano group; and an organic light-emitting element display device comprising the same.

Thermosetting composition for organic light-emitting element filler and organic light-emitting element display device comprising same

A compound represented by Chemical Formula 1 wherein each substituent is the same as defined in the specification, a photosensitive resin composition including the same, and a color filter manufactured using the photosensitive resin composition are provided. 

Compound, photosensitive resin composition comprising the same, and color filter

The present invention relates to an encapsulating composition, a barrier layer including the same, and an encapsulated apparatus including the same, and the composition comprises (A) a photocurable monomer and (B) a photocurable monomer containing a carboxylic acid group, wherein (B) the photocurable monomer containing the carboxylic acid group has an amide bond.

Encapsulating composition, barrier layer including same, and encapsulated apparatus including same

Disclosed are a photocurable composition which includes (A) a photocurable monomer and (B) a monomer represented by Formula 1, and an apparatus including a protective layers formed of the composition; 

Photocurable composition, protective layer including the same, and encapsulated apparatus including the same

The present invention relates to a photocurable composition, to a barrier layer including same, and to an encapsulated device including same, wherein the composition comprises a photocurable monomer(A) and a silicon containing monomer(B), wherein the silicon containing monomers(B) has a structure according to Formula 1.

Photocurable composition, barrier layer including same, and encapsulated device including same

The present invention relates to: a photocurable composition comprising a silicone-based compound having a repeating unit represented by the chemical formula A (linear or branched alkylene oxide having a carbon number 1-15) and a photocurable functional group; a barrier layer comprising the same; and an encapsulated device comprising the barrier layer.

Photocurable composition, barrier layer comprising same, and encapsulated device comprising same

A photocurable composition, a composition for encapsulation of an organic light emitting diode, and an encapsulated apparatus, wherein, in the photocurable composition, when A represents a glass-metal alloy die shear strength in kgf between a glass substrate and a Ni/Fe alloy after curing, and B represents curing shrinkage in % as determined by Equation 1, below, and the photocurable composition has a value for A/B of about 0.7 kgf/% or more and the glass-metal alloy die shear strength of about 2.5 kgf or more,Curing shrinkage=|(Specific gravity of solid photocurable composition after curing)&#x2212;(Specific gravity of liquid photocurable composition before curing)|/(Specific gravity of liquid photocurable composition before curing)&#xd7;100.&#x2003;&#x2003;&#x3c;Equation 1&#x3e;

Photocurable composition and encapsulated apparatus prepared using the same

The present invention relates to a photocurable adhesive composition. The photocurable adhesive composition comprises a urethane(meth)acrylate resin, a functional-group-containing polybutadiene, a photocurable monomer and a photoinitiator; and the functional group is either an epoxy group or a hydroxyl group. The photocurable adhesive composition ensures good outdoor readability, has outstanding adhesive properties, and impact strength and optical transparency, and minimizes the phenomenon whereby substantial contraction occurs during photocuring, and thus can be suitably used for a display.

Photocurable adhesive composition and display device comprising same

A photocurable pressure-sensitive adhesive (PSA) composition includes an acrylic PSA binder, the acrylic PSA binder including at least one fluoro group in an amount of about 6 mol % to about 30 mol % based on a total amount of the acrylic PSA binder, a thermal curing agent, and a photoinitiator.

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Uiwang-si, South Korea

Seung Jib Choi