Amkor Technology Singapore Holding Pte. Ltd.

Seung Jae Yu

Won Bae Bang

Dong Joo Park

Jae Yun Kim

Jin Young Khim

Shaun Bowers

Min Hwa Chang

Gi Tae Lim

Gyu Wan Han

Se Hwan Hong

Myung Jea Choi

Byoung Woo Cho

Seul Bee Lee

Ju Hyung Lee

Kyung Rok Park

SAng Hyeon Kang

Ju Young Lee

Sang Goo Kang

In one example, a semiconductor device can comprise a substrate, a device stack, first and second internal interconnects, and an encapsulant. The substrate can comprise a first and second substrate sides opposite each other, a substrate outer sidewall between the first substrate side and the second substrate side, and a substrate inner sidewall defining a cavity between the first substrate side and the second substrate side. The device stack can be in the cavity and can comprise a first electronic device, and a second electronic device stacked on the first electronic device. The first internal interconnect can be coupled to the substrate and the device stack. The encapsulant can cover the substrate inner sidewall and the device stack and can fill the cavity. Other examples and related methods are disclosed herein.

Semiconductor devices and related methods

In one example, a semiconductor device can comprise a substrate, a device stack, first and second internal interconnects, and an encapsulant. The substrate can comprise a first and second substrate sides opposite each other, a substrate outer sidewall between the first substrate side and the second substrate side, and a substrate inner sidewall defining a cavity between the first substrate side and the second substrate side. The device stack can be in the cavity and can comprise a first electronic device, and a second electronic device stacked on the first electronic device. The first internal interconnect can be coupled to the substrate and the device stack. The second internal interconnect can be coupled to the second electronic device and the first electronic device. The encapsulant can cover the substrate inner sidewall and the device stack, and can fill the cavity. Other examples and related methods are disclosed herein.

Growing community of inventors

Incheon, South Korea

Seung Jae Yu