Samsung Electro-Mechanics Co., Ltd.

Seung Ick Lee

Hun Joo Hahm

Young Sam Park

Hyung Suk Kim

Jung Park

Young June Jeong

Ho Sik Ahn

Bum Jin Kim

An LED package frame includes an LED chip and a heat conductive member made of high heat conductivity material. The heat conductive member has a receiving part at a lateral portion, and is mounted with the LED chip. A lead-coating assembly configured to be inserted into the receiving part of the heat conductive member, including a lead is inserted at one end into the receiving part of the heat conductive member, and electrically connected to the LED chip. An electrically insulating layer is placed in tight contact between the lead and the receiving part of the heat conductive member isolates the lead from the receiving part. With the lead inserted into the heat conductive member, it is possible to reduce size while maintaining high heat conductivity and stability.

LED package frame and LED package having the same

Growing community of inventors

Kyungki-do, South Korea

Seung Ick Lee