Samsung Electro-Mechanics Co., Ltd.

Hyundai Motor Company

Kia Motors Corporation

Seung Hyun Ra

Jung Woo Lee

Yong Suk Kim

Jong Myeon Lee

Ho Sung Choo

Choon Keun Lee

Hyoung Ho Kim

Hyo Soon Shin

Jae Choon Cho

Kay Hyeok An

Young Hee Lee

Sang Soo Park

Soo Hwan Son

Sang Moon Lee

Hae Suk Chung

Kyeong Jun Kim

Kyung Pyo Hong

Young Key Kim

Jeong Bok Kwak

Soon Ju Lee

Min Hyang Kim

Chi Seong Kim

Kyoung Jin Jun

Tae Ho Song

Chang Yong Lee

Yong Gyu Han

Mi Suk Lee

Il Sang Maeng

Yu Seon Shin

A laminated electronic component includes a first capacitor including a first ceramic body, first external electrodes disposed on upper and lower surfaces of the first ceramic body, and second external electrodes disposed apart from the first external electrodes on the upper and lower surfaces of the first ceramic body, and a second capacitor including a second ceramic body, a third external electrode disposed on a lower surface of the second ceramic body, and a fourth external electrode disposed apart from the third external electrode on the lower surface of the second ceramic body, and disposed on the first capacitor and electrically connected to the first capacitor. A current loop passing through the upper surface of the first ceramic body and the lower surface of the second ceramic body is formed.

Laminated electronic component and circuit board for mounting the same

An electronic component includes a body including a dielectric material and an internal electrode embedded in the dielectric material, an external electrode disposed on the body and connected to the internal electrode, and a conductive adhesive connected to the external electrode. The external electrode and the conductive adhesive include a conductive resin. A circuit board includes the electronic component.

Electronic component and circuit board having the same

A multilayer electronic component includes a first capacitor including a first capacitor body and first and second external electrodes disposed on outer surfaces of the first capacitor body; and a second capacitor including a second capacitor body and third and fourth external electrodes disposed on outer surfaces of the second capacitor body and electrically connected to the first capacitor. The first and third external electrodes are connected to each other by a first metal terminal enclosing portions of a lower surface of the first external electrode to an upper surface of the third external electrode, and the second and fourth external electrodes are connected to each other by a second metal terminal enclosing portions of a lower surface of the second external electrode and an upper surface of the fourth external electrode.

Multilayer electronic component and board having the same

The present invention provides a field emitter electrode and a method for fabricating the same. The method comprises the steps of mixing a carbonizable polymer, carbon nanotubes and a solvent to prepare a carbon nanotube-containing polymer solution, electrospinning (or electrostatic spinning) the polymer solution to form a nanofiber web layer on a substrate, stabilizing the nanofiber web layer such that the polymer present in the nanofiber web layer is crosslinked, and carbonizing the nanofiber web layer such that the crosslinked polymer is converted to a carbon fiber.

Carbon-fiber web structure type field emitter electrode and fabrication method of the same

The present invention relates to a method of manufacturing a printed circuit board using an imprinting process, in which a pattern having a large area can be uniformly formed using a plurality of molds, and the plurality of molds is sequentially removed, thereby solving problems occurring in release of the molds from an insulating layer.

Method of manufacturing printed circuit board using imprinting process

Disclosed is a method of manufacturing a printed circuit board for fine circuit formation, in which an unnecessary metal layer formed on the upper portion of a circuit pattern is removed through mechanical polishing and then chemical etching. In place of expensive chemical mechanical polishing, in the method of the invention, mechanical polishing and chemical etching are continuously applied to thus sequentially remove and planarize the unnecessary metal layer. Thereby, through an inexpensive, simple, and continuous process, the planarization procedure can be precisely performed, thus making it possible to apply the method to large areas and economically realize a fine circuit pattern.

Method of manufacturing printed circuit board for fine circuit formation

Fabrication method of carbon-fiber web structure type field emitter electrode

A method for manufacturing a multilayer ceramic capacitor, in which internal electrodes printed on each of a plurality of dielectric sheets have reduced thicknesses using an absorption member, thereby allowing the multilayer ceramic capacitor to have a high capacity and be minimized. The method includes printing the internal electrodes on each of the dielectric sheets, and stacking the dielectric sheets, wherein the internal electrodes formed on each of the dielectric sheets have a reduced thickness by causing an absorptive member to contact the surface of each of the dielectric sheets provided with the internal electrodes and then separating the absorptive member from the surface so that portions of the internal electrodes having a designated thickness are eliminated, and the dielectric sheets provided with the internal electrodes having the reduced thickness are stacked to form a chip element.

Method for manufacturing multilayer ceramic capacitor

Disclosed herein is a method of manufacturing a multilayered ceramic capacitor by a spin coating process, and a multilayered ceramic capacitor obtained by the above method. The method of the current invention provides a plurality of dielectric layers formed by spin coating, in which the process of coating the dielectric layer and the process of printing the inner electrode can be provided as a single process. Therefore, the thickness of the dielectric layer is easily controlled while the dielectric layer is formed to be thin. Further, since the dielectric layers and the inner electrodes are formed successively, the processes of separating and layering the dielectric layers, and the process of compressing the ceramic multilayered body can be omitted. Thereby, the ceramic multilayered body need not be compressed, and thus, a pillowing phenomenon does not occur in the multilayered ceramic capacitor.

Method of manufacturing multilayered ceramic capacitor by spin coating and multilayered ceramic capacitor

A triplexer and a multilayered structure thereof. The triplexer comprises a first filter circuit and a low pass filter circuit connected in parallel to an input terminal, and a second filter circuit and a third filter circuit connected in parallel to an output terminal of the low pass filter circuit. The first filter circuit passes a signal of a first frequency band, and the low pass filter circuit passes a signal of a predetermined frequency band which is lower than the first frequency band. The second filter circuit extracts a signal of a second frequency band from the predetermined frequency band signal, and the third filter circuit extracts a signal of a third frequency band from the predetermined frequency band signal, which third frequency band is lower than the second frequency band. The low pass filter circuit includes a notch circuit for extending a portion of the predetermined frequency band, neighboring the first frequency band. According to the invention, the triplexer can separate an input signal received at the input terminal into the signals of the first, second and third frequency bands.

Triplexer and multilayered structure thereof

Growing community of inventors

Kyungki-do, South Korea

Seung Hyun Ra