Lumens Co., Ltd.

Seung-Hyun Oh

Dae-Gil Jung

Sung-Sik Jo

Seung-Hoon Lee

Jung-A Lim

Bo-Young Kim

Ji-Yeon Lee

Hyo-Gu Jeon

Sung-Yole Yun

Kang-Min Han

Suk-Min Han

Jung-Hyun Park

Yun-Geon Cho

Bo-Gyun Kim

Jun-Hyeok Han

Pyoung-Gug Kim

Chun-Ki Min

Chul-Yeun Choi

Hong-Geol Choi

Sung-Ok Choi

Sang-Hyub Gim

Disclosed herein are a light emitting device package, a backlight unit, and a method of manufacturing a light emitting apparatus capable of being used for a display application or an illumination application. The light emitting device package includes: a substrate, a light emitting, a reflection molding member, an upper cover, and an interval maintaining part.

Light emitting device package, backlight unit, and method of manufacturing light emitting apparatus

Disclosed herein are a light emitting device package, a backlight unit, an illumination apparatus, and a method of manufacturing a light emitting device package capable of being used for a display application or an illumination application. The light emitting device package includes: a flip-chip type light emitting device having a first terminal and a second terminal installed therebeneath; a substrate having a first electrode formed at one side of an electrode separating space and a second electrode formed at the other side thereof; a first conductive bonding member installed on the first electrode of the substrate so as to be electrically connected to the first terminal of the light emitting device; a second conductive bonding member installed on the second electrode of the substrate so as to be electrically connected to the second terminal of the light emitting device; a reflection encapsulant molded and installed on the substrate so as to form a reflection cup part reflecting light generated in the light emitting device and filled in the electrode separating space to form an electrode separating part; and a filler filled between the reflection cup part and the first and second conductive bonding members.

Light emitting device package, backlight unit, illumination apparatus, and method of manufacturing light emitting device package

Disclosed herein is a backlight unit including a flat substrate, a light emitting device mounted on the flat substrate, a light guide plate disposed on the flat substrate, and a reflector being inserted to be disposed in a through-hole and having a contacted reflection portion contacted to the light emitting device and a spaced reflection portion spaced from the light emitting device. The light guide plate may include an inner wall surface defining the through-hole which accommodates the light emitting device. The contacted reflection portion and the spaced reflection portion are configured to reflect light generated in the light emitting device to penetrate into the light guide plate through the inner wall surface.

Backlight unit, double cone-shaped reflector, double cone-shaped reflector strip, illumination apparatus, and method of manufacturing double cone-shaped reflector

A light emitting device apparatus is provided. For example, a light emitting device package include a substrate, a light emitting device, a reflection molding member, an upper cover and an interval maintaining part. The substrate includes a first electrode and a second electrode. The light emitting device includes a first pad electrically connected to the first electrode and a second pad electrically connected to the second electrode. The reflection molding member includes a form and a reflection cup part. The upper cover is formed in a shale corresponding to that of an upper surface of the reflection molding member, and the interval maintaining part is formed at the upper cover such that a predetermined optical interval is maintained between a light guide plate and the light emitting device.

Light emitting device package with an upper cover having an interval maintaining part, backlight unit, and method of manufacturing light emitting apparatus

Disclosed herein is a light emitting device package strip capable of being used for a display application or an illumination application. The light emitting device package strip may include: a light emitting device package; and an upper adhesive sheet attached onto an upper surface of the light emitting device package so as to support the light emitting device package, wherein the light emitting device package includes: a flip-chip light emitting device having a first electrode pad and a second electrode pad; and a molding member formed to enclose side surfaces and an upper surface of the light emitting device such that the first electrode pad and the second electrode pad are exposed.

Light emitting device package strip

Disclosed herein are a light emitting device package, a backlight unit, and a method of manufacturing a light emitting device package capable of being used for a display application or an illumination application. The light emitting device package includes: a flip-chip type light emitting device having a first pad and a second pad; a lead frame having a first electrode installed at one side of an electrode separation space and a second electrode installed at the other side thereof, and having the light emitting device seated thereon; a first bonding medium installed between the first pad and the first electrode so that the first pad of the light emitting device and the first electrode of the lead frame are electrically connected to each other; and a second bonding medium installed between the second pad and the second electrode so that the second pad of the light emitting device and the second electrode of the lead frame are electrically connected to each other, wherein at least one first accommodating cup part accommodating the first bonding medium therein is formed in the first electrode of the lead frame, and at least one second accommodating cup part accommodating the second bonding medium therein is formed in the second electrode of the lead frame.

Light emitting device package, backlight unit, and method of manufacturing light emitting device package

There are provided a chip-on-board type light emitting device package capable of improving structural reliability and heat-dissipating efficiency and reducing a manufacturing cost, and a method for manufacturing the same. The chip-on-board type light emitting device package includes: a dual frame including a base frame on which a plurality of light emitting devices are mounted and an electrode frame positioned above the base frame so as to be spaced apart from the base frame and including two electrodes separated from each other; and a molding part coupled to the dual frame so that the base frame and the electrode frame are spaced apart from each other and having an opening through which light generated in the plurality of light emitting devices is to be emitted, wherein the base frame has a through-hole through which the electrode frame is exposed.

Method for manufacturing improved chip-on-board type light emitting device package and such manufactured chip-on-board type light emitting device package

Growing community of inventors

Gwangju-si, South Korea

Seung-Hyun Oh