Lumens Co., Ltd.

Hyundai Motor Company

Kia Motors Corporation

Samsung Electronics Co., Ltd.

Industry-University Cooperation Foundation Hanyang University

Seung Hyun Oh

Jung Hyun Park

Bo Gyun Kim

Yun Geon Cho

Jung A Lim

Pyoung Gug Kim

Seung Hoon Lee

Sung Sik Jo

Hyo Gu Jeon

Jun Hyung Lim

Bo Hyun Chung

Suk Min Han

Cheol Hun Jung

Jun Hyeok Han

Chun Ki Min

Young Mi Na

Byeong Cheol Shim

Jong Kyung Lee

Seok Lee

In Soo Kim

Seung Jin Kim

Tae Kyung Yoo

Woo Jin Jang

Sung Yole Yun

Dae Gil Jung

Chi Gyun Song

Tae Hyung Kim

Jae Hoon Lee

Sun Choi

Jong Woo Lee

Wan Ho Kim

Kyung Min Lee

Yong Sub Yoon

Dong Wook Shin

Sung Woo Noh

Oh Min Kwon

Chan Hwi Park

Sun Jin Kim

Yong Gyu Lim

Hyun Seok Jang

Jung Hye Park

Ho Joong Lim

Pyeong Guk Kim

Jae Hong Jung

Byung Ki Han

Byeong Geon Kim

In Yeol Hong

In Woo Son

Jae Yoon Lim

A surface light source module includes a substrate, a plurality of light-emitting elements mounted on the substrate, a first optical layer disposed on the light-emitting elements to cover the light-emitting elements and configured to disperse light emitted from the light-emitting elements, and a second optical layer disposed on the first optical layer and configured to absorb the light emitted from the light-emitting elements and emit light of a different wavelength band from a wavelength of the absorbed light, wherein a distance from an upper surface of the first optical layer to an upper surface of the second optical layer has a value less than a distance from an upper surface of the substrate to the upper surface of the first optical layer.

Surface light source module and method of manufacturing the same

A clock generating circuit includes a first frequency multiplier configured to generate a second clock signal having a second frequency based on a first clock signal having a first frequency, and a second frequency multiplier configured to generate a third clock signal having a third frequency based on the second clock signal. The first frequency multiplier includes a circuit configured to control a duty cycle of the first clock signal, a delay circuit configured to receive the duty controlled clock signal, and delay the received signal based on a duty cycle of the second clock signal to output a first delay clock signal, and an XOR gate configured to perform an XOR computation using the duty controlled clock signal and the first delay clock signal to output the second clock signal. The second frequency is greater than the first frequency, and the third frequency is greater than the second frequency.

Clock generating circuit and wireless communication device including the same

A leaf spring may include: an upper plate provided with arc-shaped portions which are integrally formed on both end portions thereof, respectively, for forming spring eyes; a lower plate disposed to overlap a lower side of the upper plate and provided with arc-shaped portions which are integrally formed on both end portions thereof, respectively, and face the arc-shaped portions of the upper plate to form the spring eyes; clamping units installed to restrain the both end portions of the overlapped upper and lower plates from being separated from each other; and a central fastening unit configured to fasten central portions of the overlapped upper and lower plates.

Leaf spring

A suspension system for a vehicle with a composite spring may include: a first longitudinally mounted springand a second longitudinally mounted springgenerating vertical stiffness of a vehicle; and a transversely mounted springgenerating roll stiffness and connected to the first and second longitudinally mounted springs. In particular, the transversely mounted springis connected to a vehicle bodyby a support member. Stiffness of the vehicle may be further strengthened during a longitudinal behavior and a rolling behavior of the vehicle, and thus, running stability may be significantly enhanced.

Suspension system for vehicle with composite spring

The present invention relates to an apparatus and a method for manufacturing a light-emitting diode (LED) module and, more particularly, to an apparatus and a method for manufacturing a light-emitting diode module, which are capable of manufacturing a light emitting diode module on which a plurality of light-emitting diodes are mounted with an improved bonding speed and high accuracy by manufacturing the light-emitting diode module by simultaneously transferring the plurality of light emitting diodes onto a substrate by using a multi-eject pin or a multi-collet. An apparatus for manufacturing a light-emitting diode (LED) module according to one embodiment of the present invention, in which the light-emitting diode module comprises a plurality of light-emitting diodes each having one side surface with an exposed electrode surface and the other side surface corresponding to the one side surface, comprises: a sheet placement unit in which a sheet having a lower portion to which the other side surfaces of the plurality of light-emitting diodes are adhered is placed; a substrate placement unit in which a substrate is placed at a position corresponding to the sheet in the lower portion of the sheet, wherein the substrate has thereon a conductive pattern to which the one side surfaces of the plurality of light-emitting diodes are electrically contacted; and a multi-transfer unit having, on a higher portion of the sheet, a plurality of eject pins for transferring the plurality of light-emitting diodes adhered to the lower portion of the sheet onto the substrate, wherein the multi-transfer unit is characterized in that the plurality of eject pins transfer the plurality of light-emitting diodes onto the substrate.

Apparatus and method for manufacturing light-emitting diode module

The present invention relates to a micro Light Emitting Diode (LED) matrix array package, including: a plurality of light emitting devices including a base substrate and a semiconductor laminated layer formed on the base substrate; a plurality of solder balls formed on the semiconductor laminated layer of the plurality of light emitting devices, respectively; a molding member configured to surround the light emitting devices and the solder balls; and a circuit board formed on the molding member, in which upper surfaces of the solder balls are exposed from the molding member, the circuit board includes a contact layer consisted of a metal pattern layer electrically connected with the plurality of solder balls exposed from the molding member and an insulating layer adjacently disposed to the metal pattern layer, and a thickness from the base substrate of each of the plurality of light emitting devices to an upper surface of each of the exposed solder balls is the same each other.

LED array package and manufacturing method thereof

An analog-to-digital converter includes a comparator configured to compare an input signal with a reference signal and to output a comparison signal indicating a corresponding comparison result, a control logic configured to output a control signal for adjusting the reference signal based on the comparison signal, and a reference signal adjusting circuit configured to adjust the reference signal based on the control signal. The comparator includes a first pre-amplifier configured to amplify a difference between the input signal and the reference signal using a first transistor having a first size, a second pre-amplifier configured to amplify the difference between the input signal and the reference signal using a second transistor having a second size different from the first size, and a latch configured to generate the comparison signal using at least one of an output of the first and second pre-amplifiers. The first and second pre-amplifiers share the latch.

Analog-to-digital converter and method of performing analog-to-digital conversion

A semiconductor device and a method for controlling amplitude of signal in the semiconductor device are provided. The semiconductor device comprises a signal generator configured to output a sinewave, a comparator configured to compare a magnitude of the sinewave with a magnitude of a reference signal at a first timing corresponding to a timing control signal and to output a comparison result, and a control signal adjustor configured to adjust one of the current control signal and a timing control signal depending on the comparison result of the comparator.

Semiconductor device and method for controlling amplitude of signal in the semiconductor device

Disclosed is a light emitting element package having excellent heat radiation performance and high luminance, and a backlight unit including the same. The light emitting element package includes a package including a lead frame, a light emitting element provided on the lead frame, and a molded material combined with the lead frame and having an opening for emitting light generated by the light emitting element, and a reflection structure having an opening corresponding to the opening of the molded material, and contacting the molded material.

Light emitting device package and backlight unit comprising the same

Provided is a light emitting device package including: a light emitting device; a light transmitting plate body formed above the light emitting device and including a lower light transmitting plate, a plurality of side light transmitting plates formed on an upper surface of the lower light transmitting plate, an upper light transmitting plate corresponding to the upper surface of the lower light transmitting plate and formed on upper surfaces of the plurality of side light transmitting plates, and an empty portion formed inside; a wavelength converting unit including a first wavelength converting layer formed on a lower surface of the lower light transmitting plate and a second wavelength converting layer formed in the empty portion and covering the upper surface of the lower light transmitting plate; and an adhesive layer formed between the first wavelength converting layer and the light emitting device, in which the adhesive layer is formed on at least one side and an upper surface of the light emitting device and a lower surface of the first wavelength converting layer.

Quantum dot plate assembly and LED package and module comprising the same

Disclosed are a lens for a light-emitting device usable in a display apparatus or a lighting apparatus, and a method of manufacturing a light-emitting device package. The lens may include a lens body including a light-receiving portion provided in a lower surface of the lens body, a light-emitting portion provided on an upper surface of the lens body, and a recess provided at a center of the upper surface of the lens body, and a flat portion provided in a horizontal shape on a bottom surface of the recess perpendicularly to a main emission line of light emitted from a light-emitting device to emit at least a part of light received through the light-receiving portion, upward. A diameter of the flat portion may be 1/100 to 1/10 of an inlet diameter of the light-receiving portion.

Lens for light-emitting device and method of manufacturing light-emitting device package

The present invention relates to a light emitting element package with a thin film pad and a manufacturing method thereof, and more particularly, to a light emitting element package with a thin film pad, which mounts and molds a light emitting diode on a thin film pad formed on a substrate and then, separates the light emitting diode from the substrate and configures a light emitting element package to effectively suppress occurrence of defective soldering or the like by securing a sufficient pad area and shape required for soldering by using the thin film pad while implementing a small light emitting element package such as a chip scale package or the like and a manufacturing method thereof. Disclosed is a light emitting element package including: a plurality of light emitting diodes having a first electrode pad and a second electrode pad at a lower portion thereof; a thin film pad having the plurality of light emitting diodes mounted thereon and constituted by one common thin film pad and a plurality of individual thin film pads; and a molding layer molding the plurality of light emitting diodes and the thin film pad, in which a lower surface of the thin film pad has a light emitting element package soldering region for soldering the light emitting element package, and an area of the light emitting element package soldering region is larger than that of each of the first electrode pad and the second electrode pad of the light emitting diode.

Light emitting element package with thin film pad and manufacturing method thereof

Provided is a method for preparing a needle-like sulfide-based solid electrolyte. The method may include: preparing a solid electrolyte admixture comprising an organic solvent, LiS, PS, and LiCl; synthesizing a solid electrolyte by stirring the solid electrolyte admixture at a temperature of about 30 to 60&#xb0; C. for about 22 to 26 hours; first stirring the solid electrolyte at a speed of about 80 to 120 rpm for about 5 to 10 minutes; after the first stirring, second stirring the first stirred solid electrolyte at a speed of about 250 to 300 rpm; vacuum-drying the second stirred solid electrolyte for about 12 to 24 hours; and heat-treating the vacuum-dried solid electrolyte at a temperature of about 350 to 550&#xb0; C. for about 1 to 5 hours.

Method for preparing needle-like sulfide-based solid electrolyte

The present disclosure relates to an apparatus and a method for assembling a composite material leaf spring module, wherein the efficiency of assembly of the composite material leaf spring module is improved and a camber of a spring member of a composite material is compensated for during assembly. An apparatus for assembling a composite material leaf spring module includes a first support configured to support a central portion of the composite material leaf spring module, a pair of second supports configured to individually support springs of the composite material leaf spring module, and a base connecting the first and second supports.

Apparatus and method for assembling composite material leaf spring module

A multi-plate spring suspension of composite material for a vehicle includes: a first bracket unit mounted to a rubber spring; a second bracket unit mounted to a trunnion base; and a plurality of composite springs manufactured by impregnating reinforcing fibers with resin, coupled to the first bracket unit and the second bracket unit at opposite ends thereof, respectively, and being vertically spaced apart from each other.

Multi-plate spring suspension of composite material for vehicle

Growing community of inventors

Yongin-si, South Korea

Seung Hyun Oh