Samsung Electronics Co., Ltd.

Samsung Led Co., Ltd.

Samsung Electro-mechanics Co., Ltd.

Other

Seung Hwan Choi

Jung Park

Seong Ah Joo

Say Jang

Kyung Seob Oh

Kun Yoo Ko

Jong Hwan Baek

Yu Dong Kim

Jae Ky Roh

Jin Mo Kim

Hyunjin Kim

Jeong Min Kim

Young June Jeong

Won Joon Lee

Jaeyoung Lee

Sang-Woong Hwang

Ho Young Song

Young Sik Jeong

Ki Bong Kim

Da-Hye Park

Seoung Ju Moon

Sang Woong Hwang

Man Ki Hong

Tae Heon Han

Churl Wung Shin

June Yeob Kim

Young Ah Seong

Joung Uk Park

Tae Kyoung Park

Yeong Bin Song

Sung Ho Youn

Various embodiments of the present disclosure relate to an electronic device and a method for executing content by using sight-line information thereof, the electronic device comprising: a display; a sight-line tracking module; a memory storing at least one command; and at least one processor operatively coupled with the display, the sight-line tracking module and the memory. The at least one processor is configured to: on the basis of execution of the at least one command, control the display to display at least one content, and identify one content that a user stares at among the at least one content, based on user's sight-line information tracked through the sight-line tracking module, and in response to a sight-line movement on the identified content being sensed, display, on the display, a dynamic user interface (UI) that is dynamically varied according to the sight-line movement, and in response to a path of the user's sight-line movement satisfying a pre-selected condition, execute the identified content. Other various embodiments are also possible.

Electronic device and content executing method using sight-line information thereof

A safety software authentication terminal and a method thereof are provided, and when a safety software authentication is performed, software executed among a plurality of types of installed software is detected as a white list verification target, and whether or not to register detected verification target software in a white list, and when the verification target software is not registered in the white list, a grade is determined for the verification target software based on the number of satisfying conditions among a plurality of preset conditions, and when the grade can be registered in the white list, the verification target software is added to the whitelist, and the plurality of conditions include at least one of technical conditions that an operating system of the terminal is checkable and social engineering conditions that are checkable based on a behavior of a user.

System and method for authenticating safe software

An electronic device and a payment processing method in the electronic device are provided. The electronic device includes a memory configured to store first payment means information corresponding to a first payment means and second payment means information corresponding to a second payment means, and a processor electrically connected with the memory, wherein the processor is configured to execute a first application associated with the first payment means by activating the first payment means information, obtain a request to execute a second application associated with the second payment means, while the first application is executed, and deactivate the first payment means information based on at least the request.

Payment processing method and electronic device supporting the same

An electronic device is disclosed. The electronic device comprises a first camera and a second camera, a microphone, a display, and a processor electrically connected to the first camera, the second camera, the microphone, and the display, wherein the processor can be set to display, on the display, a user interface (UI) including a plurality of objects, acquire user gaze information from the first camera, activate, among the plurality of objects, a first object corresponding to the gaze information, determine at least one method of input, corresponding to a type of the activated first object, between a gesture input acquired from the second camera and a voice input acquired by the microphone, and execute the function corresponding to the input for the first object While an activated state of the first object is maintained, if the input of the determined method is applicable to the first object. In addition, various embodiments identified through the specification are possible.

Electronic device, mobile electronic device, and display device, which are controlled on basis of user gaze and input

A lead frame includes a bonding part to bond to a semiconductor chip, a first trench in the bonding part along a first central axis, the first central axis dividing the bonding part into two parts, and second trenches in the bonding part along a second central axis, the second central axis dividing the bonding part into two parts, and the first and second central axes vertically intersecting each other.

Lead frame and semiconductor package including the lead frame

A fuse package may include a first lead frame, a second lead frame spaced apart from the first lead frame, a package body configured to cover at least a portion of the first lead frame and at least a portion of the second lead frame, a wire fuse mounted on the first lead frame and the second lead frame, and configured to electrically connect the two lead frames, and an encapsulator configured to cover the wire fuse.

Fuse package and light emitting device module using the same

An LED light source module is provided. The LED light source module includes a circuit board having a first circuit pattern and a second circuit pattern; and a plurality of rectangular LED packages mounted on the circuit board so as to be connected to each of the first and second circuit patterns, and arranged in a row such that each of the LED packages is tilted in a predetermined direction, while long sides of adjacent LED packages facing each other. In addition, a display device having the LED light source module is provided.

LED light source module and display apparatus including the same

Provided is a light emitting diode (LED) package including a phosphor substrate; an LED chip mounted on the phosphor substrate; a circuit board mounted on the other region of the phosphor substrate excluding the region where the LED chip is mounted; an electrode connection portion for electrically connecting the LED chip and the circuit board; and a sealing member that covers the LED chip, the circuit board, and the phosphor substrate.

Light emitting diode package having an LED chip mounted on a phosphor substrate

Light-emitting diode illuminating apparatus

Provided is an LED package including a printed circuit board (PCB); a conductive structure that is formed on the PCB and is composed of any one selected from a silicon structure and an aluminum structure; and an LED chip that is mounted on the PCB and is electrically connected to the PCB through the conductive structure.

Light emitting diode package

Light emitting diode package with a phosphor substrate

There are provided a light emitting diode substrate module and a method of manufacturing the same, and a backlight unit and a method of manufacturing the same. A light emitting diode substrate module according to an aspect of the invention includes: a metal plate; an insulating film having a predetermined thickness and provided on an entire outer surface of the metal plate; a reflective film having a predetermined thickness and provided on an entire outer surface of the insulating film; and at least one light emitting diode package electrically connected to a driving circuit provided on the reflective film by pattern printing. Unnecessary material costs can be avoided by forming a predetermined driving circuit by pattern printing, and optical characteristics can be improved by stably maintaining reflection characteristics.

Light emitting diode substrate module and method of manufacturing the same, and backlight unit and method of manufacturing the same

A high power Light Emitting Diode (LED) package and a method of producing the same. The high power LED package according to the present invention includes a plurality of light emitting diode chips, a first lead frame with the light emitting diode chips mounted thereon, and a second lead frame disposed at a predetermined interval from the first lead frame. The LED package also includes a package body fixing the first and second lead frames and bonding wires for electrically connecting the plurality of LED chips with upward-inclined inner side walls thereof and a second reflecting part surrounding the entire plurality of LED chips with an upward-inclined inner side wall thereof.

High power light emitting diode package and method of producing the same

A high power Light Emitting Diode (LED) package and a method of producing the same. The high power LED package according to the present invention includes a plurality of light emitting diode chips, a first lead frame with the light emitting diode chips mounted thereon, and a second lead frame disposed at a predetermined interval from the first lead frame. The LED package also includes a package body fixing the first and second lead frames and bonding wires for electrically connecting the plurality of LED chips. The package body includes at least one first reflecting part separately surrounding each of the plurality of LED chips with upward-inclined inner side walls thereof and a second reflecting part surrounding the entire plurality of LED chips with an upward-inclined inner side wall thereof.

An LED package includes a substrate, internal electrodes provided in an even (2) number and formed on an upper surface of the substrate, external electrodes provided in the even (2) number, formed on at least a part of surfaces of the substrate other than the upper surface of the substrate, and electrically connected to the corresponding internal electrodes, and LEDs provided in the even (2) number, located on the upper surface of the substrate, and provided with an anode and a cathode. The anodes and cathodes of the LEDs are electrically connected to the internal electrodes such that the anode of each of the LEDs is connected to the anode of a neighboring one of the LEDs and the cathode of each of the LEDs is connected to the cathode of another neighboring one of the LEDs.

Growing community of inventors

Gyeonggi-do, South Korea

Seung Hwan Choi