Semes Co., Ltd.

Seung Hwan Cho

Buyoung Jung

Seungtae Yang

Junhee Youn

Disclosed are a substrate processing apparatus and a process fluid treating apparatus. The substrate processing apparatus includes a process chamber that processes a substrate with a process fluid including ozone, a discharge conduit connected to the process chamber to discharge the process fluid used to process the substrate, and a process fluid treating apparatus connected with the discharge conduit. The process fluid treating apparatus includes a housing having an inner space with a set volume in which the process fluid is received and an injection nozzle connecting the discharge conduit and the inner space of the housing.

Substrate processing apparatus, process fluid treating apparatus, and ozone decomposition method

The inventive concept relates to an apparatus for treating a substrate. According to an embodiment, the substrate treating apparatus includes a housing having a process space therein, a support unit that supports the substrate in the housing, a nozzle that dispenses a treatment liquid onto the substrate supported on the support unit, and a liquid supply unit that supplies the treatment liquid to the nozzle, in which the liquid supply unit includes a container having a storage space in which the treatment liquid is stored, a liquid supply tube that causes the treatment liquid to flow from the container to the nozzle, and a microwave applying member that applies microwaves to the treatment liquid before the treatment liquid is supplied to the nozzle.

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Ulsan, South Korea

Seung Hwan Cho